SLVS969G october   2009  – august 2023 TL331-Q1 , TL331B-Q1 , TL391B-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings, TL331-Q1
    2. 6.2  Absolute Maximum Ratings, TL331B-Q1 and TL391B-Q1
    3. 6.3  ESD Ratings, All Devices
    4. 6.4  Recommended Operating Conditions, TL331-Q1
    5. 6.5  Recommended Operating Conditions, TL331B-Q1 and TL391B-Q1
    6. 6.6  Thermal Information
    7. 6.7  Electrical Characteristics, TL331B-Q1 and TL391B-Q1
    8. 6.8  Switching Characteristics, TL331B-Q1 and TL391B-Q1
    9. 6.9  Electrical Characteristics, TL331-Q1
    10. 6.10 Switching Characteristics, TL331-Q1
    11. 6.11 Typical Characteristics, TL331-Q1
    12. 6.12 Typical Characteristics, TL331B-Q1 and TL391B-Q1
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 TL331B-Q1 and TL391B-Q1 ESD Protection
        3. 8.2.2.3 Minimum Overdrive Voltage
        4. 8.2.2.4 Output and Drive Current
        5. 8.2.2.5 Response Time
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.