SNOSDB3E June   2020  – November 2023 LM339LV-Q1 , LM393LV-Q1 , TL331LV-Q1 , TL391LV-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions for TL331LV-Q1 and TL391LV-Q1
    2. 4.2 Pin Functions: LM393LV-Q1
    3. 4.3 Pin Functions: LM339LV-Q1
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information for TL3x1LV-Q1
    5. 5.5  Thermal Information, LM393LV-Q1
    6. 5.6  Thermal Information, LM339LV-Q1
    7. 5.7  Electrical Characteristics, TL3x1LV-Q1
    8. 5.8  Switching Characteristics, TL3x1LV-Q1
    9. 5.9  Electrical Characteristics, LM393LV-Q1
    10. 5.10 Switching Characteristics, LM393LV-Q1
    11. 5.11 Electrical Characteristics, LM339LV-Q1
    12. 5.12 Switching Characteristics, LM339LV-Q1
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Open Drain Output
      2. 6.4.2 Power-On-Reset (POR)
      3. 6.4.3 Inputs
        1. 6.4.3.1 Rail to Rail Input
        2. 6.4.3.2 Fault Tolerant Inputs
        3. 6.4.3.3 Input Protection
      4. 6.4.4 ESD Protection
      5. 6.4.5 Unused Inputs
      6. 6.4.6 Hysteresis
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 Hysteresis
        1. 7.1.2.1 Inverting Comparator With Hysteresis
        2. 7.1.2.2 Non-Inverting Comparator With Hysteresis
    2. 7.2 Typical Applications
      1. 7.2.1 Window Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Square-Wave Oscillator
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
      3. 7.2.3 Adjustable Pulse Width Generator
      4. 7.2.4 Time Delay Generator
      5. 7.2.5 Logic Level Shifter
      6. 7.2.6 One-Shot Multivibrator
      7. 7.2.7 Bi-Stable Multivibrator
      8. 7.2.8 Zero Crossing Detector
      9. 7.2.9 Pulse Slicer
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Thermal Information, LM339LV-Q1

THERMAL METRIC(1) LM339LV-Q1 UNIT
D (SOIC) PW (TSSOP) RTE (WQFN) DYY (SOT-23)
14 PINS 14 PINS 16 PINS 14 PINS
RqJA Junction-to-ambient thermal resistance 136.0 155.0 134.1 211.1 °C/W
RqJC(top) Junction-to-case (top) thermal resistance 91.2 82.0 122.6 121.1 °C/W
RqJB Junction-to-board thermal resistance 92.0 98.5 109.3 120.4 °C/W
yJT Junction-to-top characterization parameter 46.9 25.7 30.9 22.3 °C/W
yJB Junction-to-board characterization parameter 91.6 97.6 108.3 120.1 °C/W
RqJC(bot) Junction-to-case (bottom) thermal resistance – – 98.7 – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.