SLVS038J January   1989  – October 2024 TL2842 , TL2843 , TL2844 , TL2845 , TL3842 , TL3843 , TL3844 , TL3845

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Pulse-by-Pulse Current Limiting
      2. 6.3.2 Error Amplifier With Low Output Resistance
      3. 6.3.3 High-Current Totem-Pole Output
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Technique
      2. 6.4.2 Slope Compensation
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Design Requirements
      2. 7.1.2 Detailed Design Procedure
        1. 7.1.2.1 Current-Sense Circuit
        2. 7.1.2.2 Error-Amplifier Configuration
        3. 7.1.2.3 Oscillator Section
      3. 7.1.3 Application Curve
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 Feedback Traces
        2. 7.3.1.2 Input/Output Capacitors
        3. 7.3.1.3 Compensation Components
        4. 7.3.1.4 Traces and Ground Planes
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • D|14
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1.1 Feedback Traces

Try to run the feedback trace as far from the inductor and noisy power traces as possible. Also, keep the feedback trace to be as direct as possible and somewhat thick. These two sometimes involve a trade-off, but keeping it away from inductor EMI and other noise sources is the more critical of the two. Run the feedback trace on the side of the PCB opposite of the inductor with a ground plane separating the two.