SLVS038J January   1989  – October 2024 TL2842 , TL2843 , TL2844 , TL2845 , TL3842 , TL3843 , TL3844 , TL3845

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Pulse-by-Pulse Current Limiting
      2. 6.3.2 Error Amplifier With Low Output Resistance
      3. 6.3.3 High-Current Totem-Pole Output
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Technique
      2. 6.4.2 Slope Compensation
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Design Requirements
      2. 7.1.2 Detailed Design Procedure
        1. 7.1.2.1 Current-Sense Circuit
        2. 7.1.2.2 Error-Amplifier Configuration
        3. 7.1.2.3 Oscillator Section
      3. 7.1.3 Application Curve
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 Feedback Traces
        2. 7.3.1.2 Input/Output Capacitors
        3. 7.3.1.3 Compensation Components
        4. 7.3.1.4 Traces and Ground Planes
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1 Layout Guidelines

Always try to use a low EMI inductor with a ferrite type closed core. Some examples would be toroid and encased E core inductors. Open core can be used if they have low EMI characteristics and are located a bit more away from the low power traces and components. Make the poles perpendicular to the PCB as well if using an open core. Stick cores usually emit the most unwanted noise.