SLVSDQ6A July   2018  – November 2018 TL431LI , TL432LI

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Temperature Coefficient
    2. 8.2 Dynamic Impedance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Open Loop (Comparator)
      2. 9.4.2 Closed Loop
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Comparator With Integrated Reference
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Basic Operation
            1. 10.2.1.2.1.1 Overdrive
          2. 10.2.1.2.2 Output Voltage and Logic Input Level
            1. 10.2.1.2.2.1 Input Resistance
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Precision Constant Current Sink
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Basic Operation
            1. 10.2.2.2.1.1 Output Current Range and Accuracy
          2. 10.2.2.2.2 Power Consumption
      3. 10.2.3 Shunt Regulator/Reference
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
          1. 10.2.3.2.1 Programming Output/Cathode Voltage
          2. 10.2.3.2.2 Total Accuracy
          3. 10.2.3.2.3 Stability
          4. 10.2.3.2.4 Start-up Time
        3. 10.2.3.3 Application Curve
      4. 10.2.4 Isolated Flyback with Optocoupler
        1. 10.2.4.1 Design Requirements
          1. 10.2.4.1.1 Detailed Design Procedure
            1. 10.2.4.1.1.1 TL431 Feedback Loop Error Calculation
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Documentation Support
      1. 13.2.1 Device Nomenclature
      2. 13.2.2 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Thermal Information

THERMAL METRIC(1) TL43xLI UNIT
DBZ
3 PINS
RθJA Junction-to-ambient thermal resistance 371.7 C/W
RθJC(top) Junction-to-case (top) thermal resistance 145.9 C/W
RθJB Junction-to-boardthermal resistance 104.7 C/W
ψJT Junction-to-top characterization resistance 23.9 C/W
ψJB Junction-to-board characterization resistance 102.9 C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.