SBAS846 November   2017 TLA2021 , TLA2022 , TLA2024

PRODUCTION DATA.  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Revision History
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 I2C Timing Requirements
   7. 7.7 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagrams
   3. 8.3 Feature Description
      1. 8.3.1 Multiplexer
      2. 8.3.2 Analog Inputs
      3. 8.3.3 Full-Scale Range (FSR) and LSB Size
      4. 8.3.4 Voltage Reference
      5. 8.3.5 Oscillator
      6. 8.3.6 Output Data Rate and Conversion Time
   4. 8.4 Device Functional Modes
      1. 8.4.1 Reset and Power-Up
      2. 8.4.2 Operating Modes
         1. 8.4.2.1 Single-Shot Conversion Mode
         2. 8.4.2.2 Continuous-Conversion Mode
   5. 8.5 Programming
      1. 8.5.1 I2C Interface
         1. 8.5.1.1 I2C Address Selection
         2. 8.5.1.2 I2C Interface Speed
         3. 8.5.1.3 Serial Clock (SCL) and Serial Data (SDA)
         4. 8.5.1.4 I2C Data Transfer Protocol
         5. 8.5.1.5 Timeout
         6. 8.5.1.6 I2C General-Call (Software Reset)
      2. 8.5.2 Reading and Writing Register Data
         1. 8.5.2.1 Reading Conversion Data or the Configuration Register
         2. 8.5.2.2 Writing the Configuration Register
      3. 8.5.3 Data Format
9. 9 Register Maps
   1. 9.1 Conversion Data Register (RP = 00h) [reset = 0000h]
   2. 9.2 Configuration Register (RP = 01h) [reset = 8583h]
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Basic Interface Connections
       2. 10.1.2 Connecting Multiple Devices
       3. 10.1.3 Single-Ended Signal Measurements
       4. 10.1.4 Analog Input Filtering
       5. 10.1.5 Duty Cycling To Reduce Power Consumption
       6. 10.1.6 I2C Communication Sequence Example
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
       3. 10.2.3 Application Curve
11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Sequencing
    2. 11.2 Power-Supply Decoupling
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13Device and Documentation Support
    1. 13.1 Device Support
       1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
14. 14Mechanical, Packaging, and Orderable Information