SBAS961A May   2019  – April 2020 TLA2528

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      TLA2528 Block Diagram and Applications
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1      Absolute Maximum Ratings
    2. 6.2      ESD Ratings
    3. 6.3      Recommended Operating Conditions
    4. 6.4      Thermal Information
    5. 6.5      Electrical Characteristics
    6. Table 1. I2C Timing Requirements
    7. Table 2. Timing Requirements
    8. Table 3. I2C Switching Characteristics
    9. 6.6      Switching Characteristics
    10. 6.7      Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Multiplexer and ADC
      2. 7.3.2  Reference
      3. 7.3.3  ADC Transfer Function
      4. 7.3.4  ADC Offset Calibration
      5. 7.3.5  I2C Address Selector
      6. 7.3.6  Programmable Averaging Filter
      7. 7.3.7  General-Purpose I/Os (GPIOs)
      8. 7.3.8  Oscillator and Timing Control
      9. 7.3.9  Output Data Format
      10. 7.3.10 I2C Protocol Features
        1. 7.3.10.1 General Call
        2. 7.3.10.2 General Call With Software Reset
        3. 7.3.10.3 General Call With a Software Write to the Programmable Part of the Slave Address
        4. 7.3.10.4 Configuring the Device for High-Speed I2C Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Power-Up and Reset
      2. 7.4.2 Manual Mode
      3. 7.4.3 Auto-Sequence Mode
    5. 7.5 Programming
      1. 7.5.1 Reading Registers
        1. 7.5.1.1 Single Register Read
        2. 7.5.1.2 Reading a Continuous Block of Registers
      2. 7.5.2 Writing Registers
        1. 7.5.2.1 Single Register Write
        2. 7.5.2.2 Set Bit
        3. 7.5.2.3 Clear Bit
        4. 7.5.2.4 Writing a Continuous Block of Registers
    6. 7.6 TLA2528 Registers
      1. 7.6.1  SYSTEM_STATUS Register (Address = 0x0) [reset = 0x80]
        1. Table 13. SYSTEM_STATUS Register Field Descriptions
      2. 7.6.2  GENERAL_CFG Register (Address = 0x1) [reset = 0x0]
        1. Table 14. GENERAL_CFG Register Field Descriptions
      3. 7.6.3  DATA_CFG Register (Address = 0x2) [reset = 0x0]
        1. Table 15. DATA_CFG Register Field Descriptions
      4. 7.6.4  OSR_CFG Register (Address = 0x3) [reset = 0x0]
        1. Table 16. OSR_CFG Register Field Descriptions
      5. 7.6.5  OPMODE_CFG Register (Address = 0x4) [reset = 0x0]
        1. Table 17. OPMODE_CFG Register Field Descriptions
      6. 7.6.6  PIN_CFG Register (Address = 0x5) [reset = 0x0]
        1. Table 18. PIN_CFG Register Field Descriptions
      7. 7.6.7  GPIO_CFG Register (Address = 0x7) [reset = 0x0]
        1. Table 19. GPIO_CFG Register Field Descriptions
      8. 7.6.8  GPO_DRIVE_CFG Register (Address = 0x9) [reset = 0x0]
        1. Table 20. GPO_DRIVE_CFG Register Field Descriptions
      9. 7.6.9  GPO_VALUE Register (Address = 0xB) [reset = 0x0]
        1. Table 21. GPO_VALUE Register Field Descriptions
      10. 7.6.10 GPI_VALUE Register (Address = 0xD) [reset = 0x0]
        1. Table 22. GPI_VALUE Register Field Descriptions
      11. 7.6.11 SEQUENCE_CFG Register (Address = 0x10) [reset = 0x0]
        1. Table 23. SEQUENCE_CFG Register Field Descriptions
      12. 7.6.12 CHANNEL_SEL Register (Address = 0x11) [reset = 0x0]
        1. Table 24. CHANNEL_SEL Register Field Descriptions
      13. 7.6.13 AUTO_SEQ_CH_SEL Register (Address = 0x12) [reset = 0x0]
        1. Table 25. AUTO_SEQ_CH_SEL Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Mixed-Channel Configuration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Digital Input
          2. 8.2.1.2.2 Digital Open-Drain Output
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Digital Push-Pull Output
  9. 9 Power Supply Recommendations
    1. 9.1 AVDD and DVDD Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.8 Oscillator and Timing Control

The device uses an internal oscillator for conversions. When using the averaging module, the host initiates the first conversion and all subsequent conversions are generated internally by the device. However, in the autonomous mode of operation, the start of the conversion signal is generated by the device. Table 7 shows that when the device generates the start of the conversion, the sampling rate is controlled by the OSC_SEL and CLK_DIV[3:0] register fields.

Table 7. Configuring Sampling Rate for Internal Conversion Start Control

CLK_DIV[3:0] OSC_SEL = 0 OSC_SEL = 1
SAMPLING FREQUENCY, fCYCLE (kSPS) CYCLE TIME, tCYCLE (µs) SAMPLING FREQUENCY, fCYCLE (kSPS) CYCLE TIME, tCYCLE (µs)
0000b 1000 1 31.25 32
0001b 666.7 1.5 20.83 48
0010b 500 2 15.63 64
0011b 333.3 3 10.42 96
0100b 250 4 7.81 128
0101b 166.7 6 5.21 192
0110b 125 8 3.91 256
0111b 83 12 2.60 384
1000b 62.5 16 1.95 512
1001b 41.7 24 1.3 768
1010b 31.3 32 0.98 1024
1011b 20.8 48 0.65 1536
1100b 15.6 64 0.49 2048
1101b 10.4 96 0.33 3072
1110b 7.8 128 0.24 4096
1111b 5.2 192 0.16 6144

The conversion time of the device (see tCONV in the Switching Characteristics table) is independent of the OSC_SEL and CLK_DIV[3:0] configuration.