SNVSCR4 July   2024 TLA431

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Temperature Coefficient
    2. 7.2 Dynamic Impedance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Closed Loop
      2. 8.4.2 Open Loop (Comparator)
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Shunt Regulator/Reference
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Programming Output/Cathode Voltage
          2. 9.2.1.2.2 Total Accuracy
          3. 9.2.1.2.3 Stability
          4. 9.2.1.2.4 Start-Up Time
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Comparator With Integrated Reference
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Basic Operation
            1. 9.2.2.2.1.1 Overdrive
          2. 9.2.2.2.2 Output Voltage and Logic Input Level
            1. 9.2.2.2.2.1 Input Resistance
        3. 9.2.2.3 Application Curve
    3. 9.3 System Examples
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

6.4 Thermal Information

THERMAL METRIC(1) TLA43x UNIT
DBZ
3 PINS
RθJA Junction-to-ambient thermal resistance 218.8 C/W
RθJC(top) Junction-to-case (top) thermal resistance 115.8 C/W
RθJB Junction-to-boardthermal resistance 53.1 C/W
ψJT Junction-to-top characterization resistance 16.6 C/W
ψJB Junction-to-board characterization resistance 52.6 C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.