SLDS162B March   2009  – December 2015 TLC59108F

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-On Reset
      2. 8.3.2 External Reset
      3. 8.3.3 Software ResetFixed address typo in the Software Reset Section
      4. 8.3.4 Individual Brightness Control With Group Dimming or Blinking
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Device Address
      2. 8.5.2 Regular I2C Bus Slave Address
      3. 8.5.3 LED All Call I2C Bus Address
      4. 8.5.4 LED Sub Call I2C Bus Address
      5. 8.5.5 Software Reset I2C Bus Address
      6. 8.5.6 Characteristics of the I2C Bus
        1. 8.5.6.1 Bit Transfer
        2. 8.5.6.2 Start and Stop Conditions
      7. 8.5.7 System Configuration
      8. 8.5.8 Acknowledge
    6. 8.6 Register Maps
      1. 8.6.1 Control Register
      2. 8.6.2 Mode Register 1 (MODE1)
      3. 8.6.3 Mode Register 2 (MODE2)
      4. 8.6.4 Individual Brightness Control Registers (PWM0-PWM7)
      5. 8.6.5 Group Duty Cycle Control Register (GRPPWM)
      6. 8.6.6 Group Frequency Register (GRPFREQ)
      7. 8.6.7 LED Driver Output State Registers (LEDOUT0, LEDOUT1)
      8. 8.6.8 I2C Bus Sub-Address Registers 1 to 3 (SUBADR1-SUBADR3)
      9. 8.6.9 LED All Call I2C Bus Address Register (ALLCALLADR)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Setting LED Current
      2. 9.1.2 PWM Brightness Dimming
      3. 9.1.3 TLC59108 and TLC59108F DifferencesTLC59108 and TLC59108F Differences section.
      4. 9.1.4 Connecting Multiple Devices
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

PW Package
20-Pin TSSOP
Top View
TLC59108F po_pw_lds162.gif
N.C. – No internal connection
RGY Package
20-Pin VQFN With Exposed Thermal Pad
Top View
TLC59108F po_rgy_lds162.gif

Pin Functions

PIN I/O(1) DESCRIPTION
NAME NO.
A0 2 I Address input 0
A1 3 I Address input 1
A2 4 I Address input 2
A3 5 I Address input 3
GND 8 – Ground
13
16
N.C. 1 I No internal connection
OUT0 6 O Open-drain output 0 to 7, LED ON at low
OUT1 7
OUT2 9
OUT3 10
OUT4 11
OUT5 12
OUT6 14
OUT7 15
RESET 17 I Active-low reset input
SCL 18 I Serial clock input
SDA 19 I/O Serial data input/output
VCC 20 – Power supply
(1) I = input, O = output