SLDS157E February   2008  – December 2014 TLC59116

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection
      2. 9.3.2 Overtemperature Detection and Shutdown
      3. 9.3.3 Power-On Reset (POR)
      4. 9.3.4 External Reset
      5. 9.3.5 Software Reset
      6. 9.3.6 Individual Brightness Control With Group Dimming/Blinking
    4. 9.4 Device Functional Modes
      1. 9.4.1 Active
      2. 9.4.2 Standby
    5. 9.5 Register Maps
      1. 9.5.1  Mode Register 1 (MODE1)"SLEEP" to "OSC" in Mode Register 1 (MODE1) Table.
      2. 9.5.2  Mode Register 2 (MODE2)
      3. 9.5.3  Brightness Control Registers 0 to 15 (PWM0 to PWM15)
      4. 9.5.4  Group Duty Cycle Control Register (GRPPWM)
      5. 9.5.5  Group Frequency Register (GRPFREQ)
      6. 9.5.6  LED Driver Output State Registers 0 to 3 (LEDOUT0 to LEDOUT3)
      7. 9.5.7  I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3)
      8. 9.5.8  LED All Call I2C Bus Address Register (ALLCALLADR)
      9. 9.5.9  Output Gain Control Register (IREF)
      10. 9.5.10 Error Flags Registers (EFLAG1, EFLAG2)
      11. 9.5.11 Control Register
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Device Address
      2. 10.1.2 Regular I2C Bus Slave Address
      3. 10.1.3 LED All Call I2C Bus Address
      4. 10.1.4 LED Sub Call I2C Bus Address
      5. 10.1.5 Software Reset I2C Bus Address
      6. 10.1.6 Characteristics of the I2C Bus
        1. 10.1.6.1 Bit Transfer
        2. 10.1.6.2 Start and Stop Conditions
        3. 10.1.6.3 Acknowledge
      7. 10.1.7 System Configuration
      8. 10.1.8 Constant Current Output
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Adjusting Output Current
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

The I2C signals (SDA / SCL) should be kept away from potential noise sources.

The traces carrying power through the LEDS should be wide enough to the handle necessary current.

All LED current passes through the device and into the ground node. There must be a strong connection between the device ground and the circuit board ground. For the RHB package, the thermal pad should be connected to ground to help dissipate heat.

12.2 Layout Example

TLC59116-layout.gifFigure 23. PW Layout Example
layex_slds157.gifFigure 24. RHB Layout Example

The thermal relief vias are connected to the power pad of the RHB package shown in Figure 24.

12.3 Thermal Considerations

The maximum IC junction temperature should be restricted to 150°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given ambient temperature, use the following equation as a guideline:

Equation 8. eq2_lvsbh4.gif

where

  • PD(max) = maximum allowable power dissipation
  • TJ(max) = maximum allowable junction temperature (150°C for the TLC59116)
  • TA = ambient temperature of the device
  • ΘJA = junction to air thermal impedance.

See Thermal Information section. This parameter is highly dependent upon board layout.

Power dissipation in the device is determined by the LED current and the voltage at the OUTx pins. For example, if the LED current is 50 mA continuous through each channel and the output voltage is 1 V on each channel, then the total power dissipation is 50 mA x 1 V x 16 ch = 0.8 W