SLVS695D June   2007  – January 2015 TLC5916 , TLC5917

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: VDD = 3 V
    6. 7.6  Electrical Characteristics: VDD = 5.5 V
    7. 7.7  Switching Characteristics: VDD = 3 V
    8. 7.8  Switching Characteristics: VDD = 5.5 V
    9. 7.9  Timing Requirements
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection Principle
      2. 9.3.2 Short-Circuit Detection Principle (TLC5917 Only)
      3. 9.3.3 Overtemperature Detection and Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation Mode Switching
        1. 9.4.1.1 Normal Mode Phase
        2. 9.4.1.2 Special Mode Phase
      2. 9.4.2 Reading Error Status Code in Special Mode
      3. 9.4.3 Writing Configuration Code in Special Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Constant Current
      2. 10.1.2 Adjusting Output Current
      3. 10.1.3 Cascading Implementation of TLC591x Device
      4. 10.1.4 8-Bit Configuration Code and Current Gain
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

10.1 Application Information

10.1.1 Constant Current

In LED display applications, TLC591x provides nearly no current variations from channel to channel and from IC to IC. While 5 mA ≤ IOUT ≤ 100 mA, the maximum current skew between channels is less than ±3% and between ICs is less than ±6%.

10.1.2 Adjusting Output Current

TLC591x scales up the reference current, Iref, set by the external resistor Rext to sink a current, Iout, at each output port. Users can follow the below formulas to calculate the target output current IOUT,target in the saturation region. In the equations,

Rext is the resistance of the external resistor connected between the R-EXT terminal and ground and VR-EXT is the voltage of R-EXT, which is controlled by the programmable voltage gain (VG). VG is defined by the Configuration Code.

Equation 1. VR-EXT = 1.26 V × VG
Equation 2. Iref = VR-EXT/Rext,
Equation 3. IOUT,target = Iref × 15 × 3CM – 1

The Current Multiplier (CM) determines that the ratio IOUT,target/Iref is 15 or 5. After power on, the default value of VG is 127/128 = 0.992, and the default value of CM is 1, so that the ratio IOUT,target/Iref = 15. Based on the default VG and CM:

Equation 4. VR-EXT = 1.26 V × 127/128 = 1.25 V
Equation 5. IOUT,target = (1.25 V/Rext) × 15

Therefore, the default current is approximately 52 mA at 360 Ω and 26 mA at 720 Ω. The default relationship after power on between IOUT,target and Rext is shown in Figure 19.

g_iout_rext.gifFigure 19. Default Relationship Curve Between IOUT,target and Rext After Power Up

10.1.3 Cascading Implementation of TLC591x Device

typapp_cascadimpl_lvs695.gifFigure 20. Cascading Implementation of TLC591x Device

10.1.4 8-Bit Configuration Code and Current Gain

Bit definition of the Configuration Code in the Configuration Latch is shown in Table 5.

Table 5. Bit Definition of 8-Bit Configuration Code

0 1 2 3 4 5 6 7
Meaning CM HC CC0 CC1 CC2 CC3 CC4 CC5
Default 1 1 1 1 1 1 1 1

Bit 7 is first sent into TLC591x through SDI. Bits 1 to 7 {HC, CC[0:5]} determine the voltage gain (VG) that affects the voltage at R-EXT and indirectly affects the reference current, Iref, flowing through the external resistor at R-EXT. Bit 0 is the Current Multiplier (CM) that determines the ratio IOUT,target/Iref. Each combination of VG and CM gives a specific Current Gain (CG).

  • VG: the relationship between {HC,CC[0:5]} and the voltage gain is calculated as shown in Equation 6 and Equation 7:
    • Equation 6. VG = (1 + HC) × (1 + D/64) / 4
    Equation 7. D = CC0 × 25 + CC1 × 24 + CC2 × 23 + CC3 × 22 + CC4 × 21 + CC5 × 20

    Where HC is 1 or 0, and D is the binary value of CC[0:5]. So, the VG could be regarded as a floating-point number with 1-bit exponent HC and 6-bit mantissa CC[0:5]. {HC,CC[0:5]} divides the programmable voltage gain VG into 128 steps and two sub-bands:

    Low voltage sub-band (HC = 0): VG = 1/4 ~ 127/256, linearly divided into 64 steps

    High voltage sub-band (HC = 1): VG = 1/2 ~ 127/128, linearly divided into 64 steps

  • CM: In addition to determining the ratio IOUT,target/Iref, CM limits the output current range.

    • High Current Multiplier (CM = 1): IOUT,target/Iref = 15, suitable for output current range IOUT = 10 mA to 120 mA.

    Low Current Multiplier (CM = 0): IOUT,target/Iref = 5, suitable for output current range IOUT = 3 mA to 40 mA

  • CG: The total Current Gain is defined as the following.
    • Equation 8. VR-EXT = 1.26 V × VG
    Equation 9. Iref = VR-EXT/Rext, if the external resistor, Rext, is connected to ground.
    Equation 10. IOUT,target = Iref × 15 × 3CM – 1 = 1.26 V/Rext × VG × 15 × 3CM – 1 = (1.26 V/Rext × 15) × CG
    Equation 11. CG = VG × 3CM – 1

    Therefore, CG = (1/12) to (127/128), and it is divided into 256 steps. If CG = 127/128 = 0.992, the IOUT,target-Rext.

Examples

  • Configuration Code {CM, HC, CC[0:5]} = {1,1,111111}

    • VG = 127/128 = 0.992 and CG = VG × 30 = VG = 0.992

  • Configuration Code = {1,1,000000}

    • VG = (1 + 1) × (1 + 0/64)/4 = 1/2 = 0.5, and CG = 0.5

  • Configuration Code = {0,0,000000}

    • VG = (1 + 0) × (1 + 0/64)/4 = 1/4, and CG = (1/4) × 3–1 = 1/12

After power on, the default value of the Configuration Code {CM, HC, CC[0:5]} is {1,1,111111}. Therefore, VG = CG = 0.992. The relationship between the Configuration Code and the Current Gain is shown in Figure 21.

ai_g_curr_gain_config_code.gifFigure 21. Current Gain vs Configuration Code

10.2 Typical Application

Figure 22 shows implementation of a single TLC591x device. Figure 20 shows a cascaded driver implementation.

typapp_singledev_lvs695.gifFigure 22. Single Implementation of TLC591x Device

10.2.1 Design Requirements

For this design example, use the parameters listed in Table 6. The purpose of this design procedure is to calculate the power dissipation in the device and the operating junction temperature.

Table 6. Design Parameters

DESIGN PARAMETERS EXAMPLE VALUE
Number of LED strings 8
Number of LEDs per string 3
LED Current (mA) 20
Forward voltage of each LED (V) 3.5
Junction-to-ambient thermal resistance (°C/W) 87.4
Ambient temperature of application (°C) 115
VDD (V) 5
IDD (mA) 10
Max operating junction temperature (°C) 150

10.2.2 Detailed Design Procedure

Equation 12. TJ = TA + RθJA × PD_TOT

where

  • TJ is the junction temperature.
  • TA is the ambient temperature.
  • RθJA is the junction-to-ambient thermal resistance.
  • PD_TOT is the total power dissipation in the IC.
Equation 13. PD_TOT = PD_CS + IDD × VDD

where

  • PD_CSis the power dissipation in the LED current sinks.
  • IDD is the IC supply current.
  • VDD is the IC supply voltage.
Equation 14. PD_CS = IO × VO × nCH

where

  • IO is the LED current.
  • VO is the voltage at the output pin.
  • nCH is the number of LED strings.
Equation 15. VO = VLED – (nLED × VF)

where

  • VLED is the voltage applied to the LED string.
  • nLED is the number of LEDs in the string.
  • VF is the forward voltage of each LED.

VO must not be too high as this causes excess power dissipation inside the current sink. However, VO also must not be too low as this does not allow the full LED current (Figure 4). With VLED = 12 V:

Equation 16. VO = 12 V – (3 × 3.5 V) = 1.5 V
Equation 17. PD_CS = 20 mA × 1.5 V × 8 = 0.24 W

Using PD_CS, calculate:

Equation 18. PD_TOT = PD_CS + IDD × VDD = 0.24 W + 0.01 A × 5 V = 0.29 W

Using PD_TOT, calculate:

Equation 19. TJ = TA + RθJA × PD_TOT = 115°C + 87.4°C/W × 0.29 W = 140°C

This design example demonstrates how to calculate power dissipation in the IC and ensure that the junction temperature is kept below 150°C.

NOTE

This design example assumes that all channels have the same electrical parameters (nLED, IO, VF, VLED). If the parameters are unique for each channel, then the power dissipation must be calculated for each current sink separately. Then, each result must be added together to calculate the total power dissipation in the current sinks.

10.2.3 Application Curve

g_iout_vout_lvs695.gifFigure 23. Output Current vs Output Voltage