SCLS711A March   2009  – November 2015 TLC59210

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: VCC = 4.5 V to 5.5 V
    6. 6.6  Electrical Characteristics: VCC = 3 V to 3.6 V
    7. 6.7  Timing Requirements: VCC = 4.5 V to 5.5 V
    8. 6.8  Timing Requirements: VCC = 3 V to 3.6 V
    9. 6.9  Switching Characteristics: VCC = 4.5 V to 5.5 V
    10. 6.10 Switching Characteristics: VCC = 3 V to 3.6 V
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Setting LED Current
      2. 9.1.2 PWM Brightness Dimming
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

(1)over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
D Input voltage –0.5 7 V
Vds Output voltage H output –0.5 32 V
Ids Output current 1 bit for output low, VCC = 3 V to 3.6 V 100 mA
VCC = 4.5 V to 5.5 V 200
IIK Input clamp current VI < 0 V –20 mA
Operating free-air temperature –40 85 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine Model (A115-A), per ANSI/ESDA/JEDEC Standard JESD-17(3) ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 200-V MM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 3 5.5 V
VIH High-level input voltage VCC × 0.7 VCC V
VIL Low-level input voltage 0 VCC × 0.3 V
Vds Output voltage 30 V
Ids Output current N package,
VCC = 4.5 V to 5.5 V		 Duty cycle < 42% 200 mA
Duty cycle < 100% 130
PW package,
VCC = 4.5 V to 5.5 V		 Duty cycle < 24% 200
Duty cycle < 100% 95
TA Operating free-air temperature –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) TLC59210 UNIT
N (PDIP) PW (TSSOP)
20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 53.6 94.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.2 28.3 °C/W
RθJB Junction-to-board thermal resistance 34.6 45.7 °C/W
ψJT Junction-to-top characterization parameter 22.3 1.6 °C/W
ψJB Junction-to-board characterization parameter 34.4 45.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics: VCC = 4.5 V to 5.5 V

over recommended operating free-air temperature range, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VT+ Positive-going input threshold D, CLR, CLK 3.5 V
VT– Negative-going input threshold D, CLR, CLK 1.5 V
VHYS Hysteresis D, CLR, CLK 0.5 2 V
IIH High-level input current VCC = 5.5 V, VI = 5.5 V 0 1 μA
IIL Low-level input current VCC = 5.5 V, VI = 0 V 0 –1 μA
IOZ Leakage current Vds= 30 V 5 μA
Ioff Leakage current VI = 0 to 5 V, VO = 0 to 30 V, VCC = 0 0 5 μA
ICC Supply current VI = 0 to 5 V, VO = 0 to 30 V, VCC = 0 Output = all OFF 0 5 μA
Output = all ON 0 5
VOL Low-level output voltage VCC = 4.5 V, IO = 100 mA 0.2 0.35 V
VCC = 4.5 V, IO = 200 mA 0.5 0.7 V
rON ON-state resistance VCC = 4.5 V, IO = 100 mA 2 3.5 Ω
Ci Input capacitance VI = VCC or GND 5 pF

6.6 Electrical Characteristics: VCC = 3 V to 3.6 V

over recommended operating free-air temperature range, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VT+ Positive-going input threshold D, CLR, CLK 2.52 V
VT– Negative-going input threshold D, CLR, CLK 0.9 V
VHYS Hysteresis D, CLR, CLK 0.33 1.32 V
IIH High-level input current VCC = 3.6 V, VI = 3.6 V 0 1 μA
IIL Low-level input current VCC = 3.6 V, VI = 0 V 0 –1 μA
IOZ Leakage current VO= 30 V 5 μA
Ioff Leakage current VCC = 0 V, VI = 0 to 3.6 V, VO = 0 to 30 V 0 5 μA
ICC Supply current VCC = 3.6 V, VI = 0 to 3.6 V, VO = 0 to 30 V Output = all OFF 0 5 μA
Output = all ON 0 5
VOL Low-level output voltage VCC = 3 V, IO = 100 mA 0.35 0.7 V
rON ON-state resistance VCC = 3 V, IO = 100 mA 3.5 7 Ω
Ci Input capacitance VI = VCC or GND 5 pF

6.7 Timing Requirements: VCC = 4.5 V to 5.5 V

over recommended operating free-air temperature range, O/C to Y (unless otherwise noted)
MIN NOM MAX UNIT
tsu Setup time, CLK↑ VDD = 4.5 V 10 ns
th Hold time, CLK↑ VDD = 4.5 V 10 ns
tw Pulse width, CLK, CLR VDD = 4.5 V 30 ns

6.8 Timing Requirements: VCC = 3 V to 3.6 V

over recommended operating free-air temperature range, O/C to Y (unless otherwise noted)
MIN NOM MAX UNIT
tsu Setup time, CLK↑ VDD = 3 V 10 ns
th Hold time, CLK↑ VDD = 3 V 10 ns
tw Pulse width, CLK, CLR VDD = 3 V 30 ns

6.9 Switching Characteristics: VCC = 4.5 V to 5.5 V

over recommended operating free-air temperature range, TA = –40°C to 85°C (unless otherwise noted), see Figure 5
PARAMETER TEST CONDITIONS LOAD CAPACITANCE MIN TYP MAX UNIT
tTLH Output = low to high TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 180 230 ns
TA = –40°C to 85°C 260
tTHL Output = high to low TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 300 450 ns
TA = –40°C to 85°C 500
tPLH Output = low to high TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 320 480 ns
TA = –40°C to 85°C 550
tPHL Output = high to low TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 320 480 ns
TA = –40°C to 85°C 550
tPHLR CLR–Y TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 320 480 ns
TA = –40°C to 85°C 550

6.10 Switching Characteristics: VCC = 3 V to 3.6 V

over recommended operating free-air temperature range, TA = –40°C to 85°C (unless otherwise noted), see Figure 5
PARAMETER TEST CONDITIONS LOAD CAPACITANCE MIN TYP MAX UNIT
tTLH Output = low to high TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 300 450 ns
T A= –40°C to 85°C 500
tTHL Output = high to low TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 300 450 ns
T A= –40°C to 85°C 500
tPLH Output = low to high TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 500 700 ns
T A= –40°C to 85°C 850
tPHL Output = high to low TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 500 700 ns
T A= –40°C to 85°C 850
tPHLR CLR–Y TA = 25°C CL = 30 pF, RL = 240 Ω,
24-V pullup		 500 700 ns
T A= –40°C to 85°C 850

6.11 Typical Characteristics

TLC59210 D001_SCLS711A_new.gif
IO = 100mA
Figure 1. rON vs VCC Conditions IO= 100mA
TLC59210 D003_SCLS711A_new.gif
CL = 30 pF RL = 240 Ω, 24-V Pullup
Figure 3. tTLH vs VCC
TLC59210 D002_SCLS711A_new.gif
IO = 100mA
Figure 2. VOL vs VCC Conditions IO = 100mA
TLC59210 D004_SCLS711A_new.gif
CL = 30 pF RL = 240 Ω, 24-V Pullup
Figure 4. Propagation Delay vs VCC