SLVS677C July   2008  – October 2015 TLC5926 , TLC5927

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: VDD = 3 V
    6. 7.6  Electrical Characteristics: VDD = 5.5 V
    7. 7.7  Timing Recommendations
    8. 7.8  Switching Characteristics: VDD = 3 V
    9. 7.9  Switching Characteristics: VDD = 5.5 V
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Open-Circuit Detection Principle
      2. 9.3.2 Short-Circuit Detection Principle (TLC5927 Only)
      3. 9.3.3 Overtemperature Detection and Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation Mode Switching
      2. 9.4.2 Normal Mode Phase
      3. 9.4.3 Special Mode Phase
        1. 9.4.3.1 Reading Error Status Code in Special Mode
      4. 9.4.4 Writing Configuration Code in Special Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Constant Current
      2. 10.1.2 Adjusting Output Current
      3. 10.1.3 16-Bit Configuration Code and Current Gain
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

The traces that carry current from the LED cathodes to the OUTx pins must be wide enough to support the default current (up to 120 mA).

The SDI, CLK, LE(ED1), OE(ED2), and SDO pins should be connected to the microcontroller. There are several ways to achieve this, including the following methods:

  • Traces may be routed underneath the package on the top layer.
  • The signal may travel through a via to another layer.

The thermal pad in the PWP package should be connected to the ground plane through thermal relief vias. This layout technique will improve the thermal performance of the package.

12.2 Layout Example

TLC5926 TLC5927 layoutex_slvs677.gif Figure 19. PWP Layout Example
TLC5926 TLC5927 layoutexdw_slvs677.gif Figure 20. DW Layout Example
TLC5926 TLC5927 layoutexdbq_slvs677.gif Figure 21. DBQ Layout Example