SBVS129A May   2009  – July 2018 TLC5952

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit (Multiple Daisy-Chained TLC5952s)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Pin Equivalent Input and Output Schematic Diagrams
    2. 7.2 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Maximum Constant-Sink-Current Value
      2. 8.3.2 Global Brightness Control (BC) Function: Sink-Current Control
      3. 8.3.3 Constant-Current Output On-Off Control
    4. 8.4 Device Functional Modes
      1. 8.4.1 LOD, LSD, and TEF Operation
      2. 8.4.2 Register and Data Latch Configuration
        1. 8.4.2.1 Output On-Off Data Latch
        2. 8.4.2.2 Control-Data Latch
        3. 8.4.2.3 Status Information Data (SID)
        4. 8.4.2.4 LED-Open Detection (LOD), LED-Short Detection (LSD), And Thermal Error Flag (TEF)
        5. 8.4.2.5 Thermal Shutdown (TSD)
        6. 8.4.2.6 Noise Reduction
  9. 9 Power Supply Recommendations
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.