SLVSCE7A May   2014  – September 2014 TLC5958

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application Circuit (Multiple Daisy-Chained TLC5958s)
  5. 5 Revision History
  6. 6 Description (Continued)
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 Handling Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Pin Equivalent Input and Output Schematic Diagrams
      1. 9.1.1 Test Circuits
    2. 9.2 Timing Diagrams
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Device Functional Modes
      1. 10.3.1  Brightness Control (BC) Function
      2. 10.3.2  Color Brightness Control (CC) Function
      3. 10.3.3  Select RIREF For a Given BC
      4. 10.3.4  Choosing BC/CC For a Different Application
        1. 10.3.4.1 Example 1: Red LED Current is 20mA, Green LED Needs 12mA, Blue LED needs 8mA
        2. 10.3.4.2 Example 2: Red LED Current is 5mA, Green LED Needs 2mA, Blue LED Needs 1mA.
      5. 10.3.5  LED Open Detection (LOD)
      6. 10.3.6  Power Save Mode (PSM)
      7. 10.3.7  Internal Pre-Charge FET
      8. 10.3.8  Thermal Shutdown (TSD)
      9. 10.3.9  IREF Resistor Short Protection (ISP)
      10. 10.3.10 Noise Reduction
  11. 11Application and Implementation
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Trademarks
    2. 14.2 Electrostatic Discharge Caution
    3. 14.3 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Device and Documentation Support

14.1 Trademarks

LGSE, PowerPAD are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

14.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

14.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.