SLVSEJ1A February   2021  – May 2022 TLC6983

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Independent and Stackable Mode
        1. 8.3.1.1 Independent Mode
        2. 8.3.1.2 Stackable Mode
      2. 8.3.2 Current Setting
        1. 8.3.2.1 Brightness Control (BC) Function
        2. 8.3.2.2 Color Brightness Control (CC) Function
        3. 8.3.2.3 Choosing BC and CC for a Different Application
      3. 8.3.3 Frequency Multiplier
      4. 8.3.4 Line Transitioning Sequence
      5. 8.3.5 Protections and Diagnostics
        1. 8.3.5.1 Thermal Shutdown Protection
        2. 8.3.5.2 IREF Resistor Short Protection
        3. 8.3.5.3 LED Open Load Detection and Removal
          1. 8.3.5.3.1 LED Open Detection
          2. 8.3.5.3.2 Read LED Open Information
          3. 8.3.5.3.3 LED Open Caterpillar Removal
        4. 8.3.5.4 LED Short/Weak Short Circuitry Detection and Removal
          1. 8.3.5.4.1 LED Short/Weak Short Detection
          2. 8.3.5.4.2 Read LED Short Information
          3. 8.3.5.4.3 LSD Caterpillar Removal
    4. 8.4 Device Functional Modes
    5. 8.5 Continuous Clock Series Interface
      1. 8.5.1 Data Validity
      2. 8.5.2 CCSI Frame Format
      3. 8.5.3 Write Command
        1. 8.5.3.1 Chip Index Write Command
        2. 8.5.3.2 VSYNC Write Command
        3. 8.5.3.3 Soft_Reset Command
        4. 8.5.3.4 Data Write Command
      4. 8.5.4 Read Command
    6. 8.6 PWM Grayscale Control
      1. 8.6.1 Grayscale Data Storage and Display
        1. 8.6.1.1 Memory Structure Overview
        2. 8.6.1.2 Details of Memory Bank
        3. 8.6.1.3 Write a Frame Data into Memory Bank
      2. 8.6.2 PWM Control for Display
    7. 8.7 Register Maps
      1. 8.7.1  FC0
      2. 8.7.2  FC1
      3. 8.7.3  FC2
      4. 8.7.4  FC3
      5. 8.7.5  FC4
      6. 8.7.6  FC10
      7. 8.7.7  FC11
      8. 8.7.8  FC12
      9. 8.7.9  FC13
      10. 8.7.10 FC14
      11. 8.7.11 FC15
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 System Structure
        2. 9.2.1.2 SCLK Frequency
        3. 9.2.1.3 Internal GCLK Frequency
        4. 9.2.1.4 Line Switch Time
        5. 9.2.1.5 Blank Time Removal
        6. 9.2.1.6 BC and CC
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Chip Index Command
        2. 9.2.2.2 FC Registers Settings
        3. 9.2.2.3 Grayscale Data Write
        4. 9.2.2.4 VSYNC Command
        5. 9.2.2.5 LED Open and Short Read
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

  • Place the decoupling capacitor near the VCC/VR, VG/VB pins and GND plane.
  • Place the current programming resistor RIREF close to IREF pin and GND plane.
  • Route the GND thermal pad as widely as possible for large GND currents. Maximum GND current is approximately 2 A for two devices (96-CH × 20 mA = 1.92 A).
  • The Thermal pad must be connected to GND plane because the pad is used as power ground pin internally. There is a large current flow through this pad when all channels turn on. Furthermore, this pad must be connected to a heat sink layer by thermal via to reduce device temperature. For more information about suggested thermal via pattern and via size, see PowerPAD™ Thermally Enhanced Package application report.
  • Routing between the LED Anode side and the device OUTXn pin must be as short and straight as possible to reduce wire inductance.
  • The line switch pins must be located in the middle of the matrix, which must be laid out as symmetrically as possible.