SLASEK2A December   2017  – August 2018 TLC6C5724-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Maximum Constant-Sink-Current Setting
      2. 7.3.2 Brightness Control and Dot Correction
      3. 7.3.3 Grayscale Configuration
        1. 7.3.3.1 PWM Auto Repeat
        2. 7.3.3.2 PWM Timing Reset
      4. 7.3.4 Diagnostics
        1. 7.3.4.1  LED Diagnostics
        2. 7.3.4.2  Adjacent-Pin-Short Check
        3. 7.3.4.3  IREF Short and IREF Open Detection
        4. 7.3.4.4  Pre-Thermal Warning Flag
        5. 7.3.4.5  Thermal Error Flag
        6. 7.3.4.6  Negate Bit Toggle
        7. 7.3.4.7  LOD_LSD Self-Test
        8. 7.3.4.8  ERR Pin
        9. 7.3.4.9  ERROR Clear
        10. 7.3.4.10 Global Reset
        11. 7.3.4.11 Slew Rate Control
        12. 7.3.4.12 Channel Group Delay
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Up
      2. 7.4.2 Device Initialization
      3. 7.4.3 Fault Mode
      4. 7.4.4 Normal Operation
    5. 7.5 Programming
      1. 7.5.1 Register Write and Read
        1. 7.5.1.1 FC-BC-DC Write
          1. 7.5.1.1.1 FC Data Write
          2. 7.5.1.1.2 BC Data Write
          3. 7.5.1.1.3 DC Data Write
        2. 7.5.1.2 Grayscale Data Write
        3. 7.5.1.3 Special Command Function
          1. 7.5.1.3.1 GS Read
          2. 7.5.1.3.2 FC-BC-DC Read
          3. 7.5.1.3.3 Status Information Data Read
    6. 7.6 Register Maps
      1. 7.6.1 GRAYSCALE Registers
        1. 7.6.1.1 OUTn_GS Register (Offset = 0h)
          1. Table 25. OUTn_GS Register Field Descriptions
      2. 7.6.2 FC-BC-DC Registers
        1. 7.6.2.1 FC-BC-DC Register (Offset = 1h)
          1. Table 28. FC-BC-DC Register Field Descriptions
      3. 7.6.3 SID Registers
        1. 7.6.3.1 SID Register (Offset = 2h)
          1. Table 31. SID Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VCC –0.3 6 V
SENSE –0.3 8
BLANK, GCLK, LATCH, SCK, SDI –0.3 VCC + 0.3
Output voltage ERR, IREF, SDO –0.3 VCC + 0.3 V
OUTR0–OUTR7, OUTG0–OUTG7, OUTB0–OUTB7 –0.3 8
Output current OUTR0–OUTR7, OUTG0–OUTG7, OUTB0–OUTB7 0 50 mA
Operating junction temperature, TJ –40 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage tothedevice.Thesearestress ratings only, which do not imply functional operation of the device attheseoranyotherconditions beyond those indicated under RecommendedOperatingConditions. Exposuretoabsolute-maximum-ratedconditions for extended periodsmayaffect device reliability.