SLASEK2A December 2017 – August 2018 TLC6C5724-Q1
PRODUCTION DATA.
Figure 35 shows a layout example for the TLC6C5724-Q1 device. To improve the thermal performance, TI recommends to use the GND plane to dissipate the heat. To filter the supply noise, users can put the capacitor as close to the VCC and SENSE pins as possible. The IREF resistor also should be connected as close to IREF pin as possible.