SLASEJ5B October   2017  – January 2020 TLC6C5816-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Enable (EN)
      2. 7.3.2 Gated Output (Gx)
      3. 7.3.3 Register Clear (CLR)
      4. 7.3.4 Open-Drain Outputs and Flexible Diagnostics Channel
        1. 7.3.4.1 Configurable Outputs
        2. 7.3.4.2 LED-Open Diagnostics
        3. 7.3.4.3 LED-Short Diagnostics
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Command Error
      7. 7.3.7 Serial Communication Error
      8. 7.3.8 Error Feedback
      9. 7.3.9 Interface
        1. 7.3.9.1 Register Write
        2. 7.3.9.2 Register Read
        3. 7.3.9.3 Shift-Register Communication-Fault Detection
        4. 7.3.9.4 Clear Register
        5. 7.3.9.5 Register Clock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 POR Reset
      3. 7.4.3 Standby Mode
    5. 7.5 Register Maps
    6. 7.6 Interface Registers
      1. 7.6.1 Configuration Register (Offset = 0h) [reset = 0h]
        1. Table 5. Configuration Register Field Descriptions
      2. 7.6.2 Fault Readback Register (Offset = 1h) [reset = 0h]
        1. Table 6. Fault Readback Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

VCC = 5 V, TJ = –40°C to 150°C unless otherwise specified
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V(POR-rising) Power-on-reset rising threshold 1.5 2.5 V
V(POR-falling) Power-on-reset falling threshold 1 V
t(device-ready) Device ready time VCC > 0.5 V, EN = 0 50 µs
ICC Logic supply current All outputs off, no clock signal , EN = 0 60 120 µA
All outputs on, no clock signal, EN = 0 210 300
ICC(FRQ) Logic supply current at frequency fSRCK = 5 MHz, CL = 30 pF, all outputs on 320 600 µA
I(Q) Quiescent current EN = 1 1 µA
VOH High-level output voltage SER OUT IOH = –20 μA 4.9 4.99 V
IOH = –4 mA 4.5 4.69
VOL Low-level output voltage SER OUT IOH = –20 μA 0.001 0.01 V
IOH = –4 mA 0.25 0.4
IIH High-level input current VI = 5 V 0.2 µA
IIL Low-level input current VI = 0 V –0.2 µA
ID(SX) Off-state drain current VDS = 30 V 0.01 0.1 µA
VDS = 30 V, TA = 125°C 0.1 0.3
rDS(on) Static drain-source on-state resistance VCC = 5 V, ID = 20 mA TA = 25°C, single channel ON 5 6.2 8 Ω
VCC = 3.3 V, ID = 20 mA TA = 25°C, all channels ON 6 7.3 9
TA = 125°C, all channels ON 9 11.6 13.5
T(SHUTDOWN) Thermal shutdown threshold 175 °C
T(HYS) Thermal shutdown hysteresis 15 °C
V(OC_th) LED-open detection threshold 4 4.3 4.5 V
Vhys(OC) LED-open detection-threshold hysteresis 60 mV
V(SC_th) LED-short detection threshold 1 1.22 1.5 V
Vhys(SC) LED-short detection-threshold hysteresis 60 mV
V(ERR_PD) ERR pin open-drain voltage drop IERR = 4 mA 0.3 V
Ilkg(ERR) ERR pin leakage current VERR = 5 V –1 1 µA