SLASEJ5B October   2017  – January 2020 TLC6C5816-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Enable (EN)
      2. 7.3.2 Gated Output (Gx)
      3. 7.3.3 Register Clear (CLR)
      4. 7.3.4 Open-Drain Outputs and Flexible Diagnostics Channel
        1. 7.3.4.1 Configurable Outputs
        2. 7.3.4.2 LED-Open Diagnostics
        3. 7.3.4.3 LED-Short Diagnostics
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Command Error
      7. 7.3.7 Serial Communication Error
      8. 7.3.8 Error Feedback
      9. 7.3.9 Interface
        1. 7.3.9.1 Register Write
        2. 7.3.9.2 Register Read
        3. 7.3.9.3 Shift-Register Communication-Fault Detection
        4. 7.3.9.4 Clear Register
        5. 7.3.9.5 Register Clock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 POR Reset
      3. 7.4.3 Standby Mode
    5. 7.5 Register Maps
    6. 7.6 Interface Registers
      1. 7.6.1 Configuration Register (Offset = 0h) [reset = 0h]
        1. Table 5. Configuration Register Field Descriptions
      2. 7.6.2 Fault Readback Register (Offset = 1h) [reset = 0h]
        1. Table 6. Fault Readback Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.