SLIS141C December 2012 – July 2016 TLC6C5912-Q1
PRODUCTION DATA.
There are no special layout requirement for the digital signal pins. The only requirement is placing the ceramic bypass capacitors near the corresponding pin.
Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat-flow path from the package to the ambient is through the cooper on the PCB. Maximizing the copper coverage is extremely important when the design does not include heat sinks attached to the PCB on the other side of the package.