SLLSEZ8D December   2017  – June 2022 TLIN1022-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC
    4. 6.4 Thermal Information
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics (1)
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  LIN (Local Interconnect Network) Bus
        1. 7.3.1.1 LIN Transmitter Characteristics
        2. 7.3.1.2 LIN Receiver Characteristics
          1. 7.3.1.2.1 Termination
      2. 7.3.2  TXD (Transmit Input and Output)
      3. 7.3.3  RXD (Receive Output)
      4. 7.3.4  VSUP (Supply Voltage)
      5. 7.3.5  GND (Ground)
      6. 7.3.6  EN (Enable Input)
      7. 7.3.7  Protection Features
      8. 7.3.8  TXD Dominant Time Out (DTO)
      9. 7.3.9  Bus Stuck Dominant System Fault: False Wake Up Lockout
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Under Voltage on VSUP
      12. 7.3.12 Unpowered Device and LIN Bus
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Standby Mode
      4. 7.4.4 Wake Up Events
        1. 7.4.4.1 Wake Up Request (RXD)
        2. 7.4.4.2 Mode Transitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Normal Mode Application Note
        2. 8.2.2.2 Standby Mode Application Note
        3. 8.2.2.3 TXD Dominant State Timeout Application Note
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 ESD Ratings - IEC

ESD and Surge Protection RatingsVALUEUNIT
V(ESD)IEC 61000-4-2 contact discharge electrostatic discharge(1)LIN bus and VSUP pin to GND(3)±6000V
V(ESD)IEC 61000-4-2 air-gap discharge electrostatic discharge(1)LIN bus and VSUP pin to GND(3)±15000
V(ESD)Powered ESD Performance, per SAEJ2962-1(2)contact discharge±8000V
V(ESD)Powered ESD Performance, per SAEJ2962-1(2)air-gap discharge±15000
ISO7637-2(4) & IEC 62215-3 Transients according to IBEE LIN EMC test spec LIN bus pin and VSUPPulse 1–100V
Pulse 275V
ISO7637-2(4) & IEC 62215-3 Transients according to IBEE LIN EMC test spec LIN bus pin and VSUPPulse 3a–150V
Pulse 3b100V
(1) IEC 61000-4-2 is a system level ESD test. Results given here are specific to the IBEE LIN EMC Test specification conditions. Different system level configurations may lead to different results
(2) SAEJ2962-1 Testing performed at 3rd party US3 approved EMC test facility, test report available upon request
(3) Testing performed at 3rd party IBEE Zwickau test house, test report available upon request
(4) ISO7637 is a system level transient test. Results given here are specific to the IBEE LIN EMC Test specification conditions. Different
system level configurations may lead to different results.