SLLSF58B July   2020  – May 2022 TLIN1027-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC
    4. 6.4 Thermal Information
    5. 6.5 Recommended Operating Conditions
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  LIN (Local Interconnect Network) Bus
        1. 8.3.1.1 LIN Transmitter Characteristics
        2. 8.3.1.2 LIN Receiver Characteristics
          1. 8.3.1.2.1 Termination
      2. 8.3.2  TXD (Transmit Input and Output)
      3. 8.3.3  RXD (Receive Output)
      4. 8.3.4  VSUP (Supply Voltage)
      5. 8.3.5  GND (Ground)
      6. 8.3.6  EN (Enable Input)
      7. 8.3.7  Protection Features
      8. 8.3.8  Bus Stuck Dominant System Fault: False Wake-Up Lockout
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 Under Voltage on VSUP
      11. 8.3.11 Unpowered Device and LIN Bus
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Sleep Mode
      3. 8.4.3 Standby Mode
      4. 8.4.4 Wake-Up Events
        1. 8.4.4.1 Wake-Up Request (RXD)
        2. 8.4.4.2 Mode Transitions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Normal Mode Application Note
        2. 9.2.2.2 Standby Mode Application Note
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TLIN1027D
TLIN1027DRB
UNIT
D (SOIC) DRB (VSON)
8-PINS 8-PINS
RΘJA Junction-to-ambient thermal resistance 115.5 48.5 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 58.7 55.5 °C/W
RΘJB Junction-to-board thermal resistance 58.9 22.2 °C/W
ΨJT Junction-to-top characterization parameter 14.1 1.2 °C/W
ΨJB Junction-to-board characterization parameter 58.2 22.2 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance - 4.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.