SLLSEX4B August   2019  – June 2022 TLIN1028-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, IEC Specification
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Supply Characteristics
    7. 7.7 Electrical Charateristics
    8. 7.8 AC Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuit: Diagrams and Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 LIN Pin
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2 TXD (Transmit Input)
      3. 9.3.3 RXD (Receive Output)
      4. 9.3.4 VSUP (Supply Voltage)
      5. 9.3.5 GND (Ground)
      6. 9.3.6 EN (Enable Input)
      7. 9.3.7 nRST (Reset Output)
      8. 9.3.8 VCC (Supply Output)
      9. 9.3.9 Protection Features
        1. 9.3.9.1 TXD Dominant Time Out (DTO)
        2. 9.3.9.2 Bus Stuck Dominant System Fault: False Wake Up Lockout
        3. 9.3.9.3 Thermal Shutdown
        4. 9.3.9.4 Under Voltage on VSUP
        5. 9.3.9.5 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
      5. 9.4.5 Mode Transitions
      6. 9.4.6 Voltage Regulator
        1. 9.4.6.1 VCC
        2. 9.4.6.2 Output Capacitance Selection
        3. 9.4.6.3 Low-Voltage Tracking
        4. 9.4.6.4 Power Supply Recommendation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Normal Mode Application Note
        2. 10.2.1.2 TXD Dominant State Timeout Application Note
        3. 10.2.1.3 Brownout
      2. 10.2.2 Detailed Design Procedures
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.9 Typical Characteristics

GUID-9B013332-7007-44A7-BC99-63D3DE7EE931-low.gif
Package = DVCC = 3.3 VTemp = Ambient
Figure 7-1 ICC vs VSUP vs Temperature
GUID-20201022-CA0I-BTNP-SQF9-HPVTRBST3NPV-low.gif
Package = DDA VCC = 3.3 V Temp = Ambient
Figure 7-3 ICC vs VSUP vs Temperature
GUID-20201020-CA0I-HR1R-PZ0Z-PW135WZCSG0F-low.gif
Package = DRBVCC = 5 VTemp = Ambient
Figure 7-5 ICC vs VSUP vs Temperature
GUID-D2313E13-770E-4DDF-B299-560BC7E66BBD-low.gif
Note:
Package = DVCC = 3.3 VTemp = Ambient
Figure 7-7 Sleep Mode Current Across VSUP and Temperature
GUID-94E87D65-BE4E-407F-B061-91B4B333AF81-low.gif
Package = DDAVCC = 3.3 VTemp = Ambient
Figure 7-9 Sleep Mode Current Across VSUP and Temperature
GUID-3C8A4FD5-210C-4C8E-89D6-CC0DD28DB02C-low.gif
Package = DRBVCC = 5 VTemp = Ambient
Figure 7-11 Sleep Mode Current Across VSUP and Temperature
GUID-20201021-CA0I-P8SF-KS5F-2HPDP7PNGPM8-low.gif
Package = DRB VCC = 3.3 V Temp = Ambient
Figure 7-2 ICC vs VSUP vs Temperature
GUID-9A8AFDD1-E6D6-4EC1-95C0-7E6D47E4641A-low.gif
Package = DVCC = 5 VTemp = Ambient
Figure 7-4 ICC vs VSUP vs Temperature
GUID-20201022-CA0I-LNC6-0QJB-PSWWBL6JCKSN-low.gif
Package = DDA VCC = 5 V Temp = Ambient
Figure 7-6 ICC vs VSUP vs Temperature
GUID-A47CE1E8-AAFF-45E0-92E8-E1F459A15BAC-low.gif
Package = DRBVCC = 3.3 VTemp = Ambient
Figure 7-8 Sleep Mode Current Across VSUP and Temperature
GUID-98FA6F4B-AB96-479C-B084-75637BDFEB59-low.gif
Package = DVCC = 5 VTemp = Ambient
Figure 7-10 Sleep Mode Current Across VSUP and Temperature
GUID-EC198B7C-0A4B-4ACB-973F-09D2A4D5EAFC-low.gif
Package = DDAVCC = 5 VTemp = Ambient
Figure 7-12 Sleep Mode Current Across VSUP and Temperature
Note: For the LDO ICC vs VSUP vs Temperature typical curves the data was collected on a high-k EVM board using a forced air system. The curves show performance based upon thermal resistance RθJB.