SLLSF61C December 2019 – June 2022 TLIN2021-Q1
PRODUCTION DATA
THERMAL METRIC(1) | TLIN2021 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DRB (VSON) | |||
PINS | PINS | |||
RθJA | Junction-to-ambient thermal resistance | 125.3 | 53.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 65.4 | 60 | °C/W |
RθJB | Junction-to-board thermal resistance | 68.7 | 25.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | 17.6 | 1.8 | °C/W |
ΨJB | Junction-to-board characterization parameter | 68.0 | 25.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | 9.8 | °C/W |