SLLSEB8C August   2012  – April  2016 TLK105 , TLK106

PRODUCTION DATA.  

  1. 1  Introduction
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Device Overview
      1. 1.3.1 Electrostatic Discharge Caution
  2. 2 Pin Descriptions
    1. 2.1 Pin Layout
    2. 2.2 Serial Management Interface (SMI)
    3. 2.3 MAC Data Interface
    4. 2.4 10Mbs and 100Mbs PMD Interface
    5. 2.5 Clock Interface
    6. 2.6 LED Interface
    7. 2.7 Reset and Power Down
    8. 2.8 Power and Bias Connections
  3. 3 Hardware Configuration
    1. 3.1  Bootstrap Configuration
    2. 3.2  Power Supply Configuration
      1. 3.2.1 Single Supply Operation
      2. 3.2.2 Dual Supply Operation
      3. 3.2.3 Variable IO Voltage
    3. 3.3  IO Pins Hi-Z State During Reset
    4. 3.4  Auto-Negotiation
    5. 3.5  Auto-MDIX
    6. 3.6  MII Isolate Mode
    7. 3.7  PHY Address
    8. 3.8  LED Interface
    9. 3.9  Loopback Functionality
      1. 3.9.1 Near-End Loopback
      2. 3.9.2 Far-End Loopback
    10. 3.10 BIST
    11. 3.11 Cable Diagnostics
      1. 3.11.1 TDR
      2. 3.11.2 ALCD
  4. 4 Interfaces
    1. 4.1 Media Independent Interface (MII)
    2. 4.2 Reduced Media Independent Interface (RMII)
    3. 4.3 Serial Management Interface
      1. 4.3.1 Extended Address Space Access
        1. 4.3.1.1 Write Address Operation
        2. 4.3.1.2 Read Address Operation
        3. 4.3.1.3 Write (no post increment) Operation
        4. 4.3.1.4 Read (no post increment) Operation
        5. 4.3.1.5 Write (post increment) Operation
        6. 4.3.1.6 Read (post increment) Operation
  5. 5 Architecture
    1. 5.1 100Base-TX Transmit Path
      1. 5.1.1 MII Transmit Error Code Forwarding
      2. 5.1.2 4-Bit to 5-Bit Encoding
      3. 5.1.3 Scrambler
      4. 5.1.4 NRZI and MLT-3 Encoding
      5. 5.1.5 Digital to Analog Converter
    2. 5.2 100Base-TX Receive Path
      1. 5.2.1  Analog Front End
      2. 5.2.2  Adaptive Equalizer
      3. 5.2.3  Baseline Wander Correction
      4. 5.2.4  NRZI and MLT-3 Decoding
      5. 5.2.5  Descrambler
      6. 5.2.6  5B/4B Decoder and Nibble Alignment
      7. 5.2.7  Timing Loop and Clock Recovery
      8. 5.2.8  Phase-Locked Loops (PLL)
      9. 5.2.9  Link Monitor
      10. 5.2.10 Signal Detect
      11. 5.2.11 Bad SSD Detection
    3. 5.3 10Base-T Receive Path
      1. 5.3.1 10M Receive Input and Squelch
      2. 5.3.2 Collision Detection
      3. 5.3.3 Carrier Sense
      4. 5.3.4 Jabber Function
      5. 5.3.5 Automatic Link Polarity Detection and Correction
      6. 5.3.6 10Base-T Transmit and Receive Filtering
      7. 5.3.7 10Base-T Operational Modes
    4. 5.4 Auto Negotiation
      1. 5.4.1 Operation
      2. 5.4.2 Initialization and Restart
      3. 5.4.3 Next Page Support
    5. 5.5 Link Down Functionality
  6. 6 Reset and Power Down Operation
    1. 6.1 Hardware Reset
    2. 6.2 Software Reset
    3. 6.3 Power Down/Interrupt
      1. 6.3.1 Power Down Control Mode
      2. 6.3.2 Interrupt Mechanisms
    4. 6.4 Power Save Modes
  7. 7 Design Guidelines
    1. 7.1 TPI Network Circuit
    2. 7.2 Clock In (XI) Requirements
      1. 7.2.1 Oscillator
      2. 7.2.2 Crystal
    3. 7.3 Thermal Vias Recommendation
  8. 8 Register Block
    1. 8.1 Register Definition
      1. 8.1.1  Basic Mode Control Register (BMCR)
      2. 8.1.2  Basic Mode Status Register (BMSR)
      3. 8.1.3  PHY Identifier Register 1 (PHYIDR1)
      4. 8.1.4  PHY Identifier Register 2 (PHYIDR2)
      5. 8.1.5  Auto-Negotiation Advertisement Register (ANAR)
      6. 8.1.6  Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
      7. 8.1.7  Auto-Negotiate Expansion Register (ANER)
      8. 8.1.8  Auto-Negotiate Next Page Transmit Register (ANNPTR)
      9. 8.1.9  Auto-Negotiation Link Partner Ability Next Page Register (ANLNPTR)
      10. 8.1.10 Control register 1 (CR1)
      11. 8.1.11 Control register 2 (CR2)
      12. 8.1.12 Control Register 3 (CR3)
      13. 8.1.13 Extended Register Addressing
        1. 8.1.13.1 Register Control Register (REGCR)
        2. 8.1.13.2 Address or Data Register (ADDAR)
      14. 8.1.14 PHY Status Register (PHYSTS)
      15. 8.1.15 PHY Specific Control Register (PHYSCR)
      16. 8.1.16 MII Interrupt Status Register 1 (MISR1)
      17. 8.1.17 MII Interrupt Status Register 2 (MISR2)
      18. 8.1.18 False Carrier Sense Counter Register (FCSCR)
      19. 8.1.19 Receiver Error Counter Register (RECR)
      20. 8.1.20 BIST Control Register (BISCR)
      21. 8.1.21 RMII Control and Status Register (RCSR)
      22. 8.1.22 LED Control Register (LEDCR)
      23. 8.1.23 PHY Control Register (PHYCR)
      24. 8.1.24 10Base-T Status/Control Register (10BTSCR)
      25. 8.1.25 BIST Control and Status Register 1 (BICSR1)
      26. 8.1.26 BIST Control and Status Register2 (BICSR2)
    2. 8.2 Cable Diagnostic Control Register (CDCR)
    3. 8.3 PHY Reset Control Register (PHYRCR)
    4. 8.4 Compliance Test register (COMPTR)
    5. 8.5 TX_CLK Phase Shift Register (TXCPSR)
    6. 8.6 Power Back Off Control Register (PWRBOCR)
    7. 8.7 Voltage Regulator Control Register (VRCR)
    8. 8.8 Cable Diagnostic Configuration/Result Registers
      1. 8.8.1  ALCD Control and Results 1 (ALCDRR1)
      2. 8.8.2  Cable Diagnostic Specific Control Registers (CDSCR1 - CDSCR4)
      3. 8.8.3  Cable Diagnostic Location Results Register 1 (CDLRR1)
      4. 8.8.4  Cable Diagnostic Location Results Register 2 (CDLRR2)
      5. 8.8.5  Cable Diagnostic Location Results Register 3 (DDLRR3)
      6. 8.8.6  Cable Diagnostic Location Results Register 4 (CDLRR4)
      7. 8.8.7  Cable Diagnostic Location Results Register 5 (CDLRR5)
      8. 8.8.8  Cable Diagnostic Amplitude Results Register 1 (CDARR1)
      9. 8.8.9  Cable Diagnostic Amplitude Results Register 2 (CDARR2)
      10. 8.8.10 Cable Diagnostic Amplitude Results Register 3 (CDARR3)
      11. 8.8.11 Cable Diagnostic Amplitude Results Register 4 (CDARR4)
      12. 8.8.12 Cable Diagnostic Amplitude Results Register 5 (CDARR5)
      13. 8.8.13 Cable Diagnostic General Results Register (CDGRR)
      14. 8.8.14 ALCD Control and Results 2 (ALCDRR2)
  9. 9 Electrical Specifications
    1. 9.1 Absolute Maximum Ratings
    2. 9.2 ESD Ratings
    3. 9.3 Recommended Operating Conditions
    4. 9.4 145
      1. 9.4.1 TLK105 32-Pin Industrial Device (85°C) Thermal Characteristics
    5. 9.5 TLK106 32-Pin Extended Temperature (105°C) Device Thermal Characteristics
    6. 9.6 DC Characteristics, VDD_IO
    7. 9.7 DC Characteristics
    8. 9.8 Power Supply Characteristics
      1. 9.8.1 Active Power, Single Supply Operation
      2. 9.8.2 Active Power, Dual Supply Operation
      3. 9.8.3 Power-Down Power
    9. 9.9 AC Specifications
      1. 9.9.1  Power Up Timing
      2. 9.9.2  Reset Timing
      3. 9.9.3  MII Serial Management Timing
      4. 9.9.4  100Mb/s MII Transmit Timing
      5. 9.9.5  100Mb/s MII Receive Timing
      6. 9.9.6  100Base-TX Transmit Packet Latency Timing
      7. 9.9.7  100Base-TX Transmit Packet Deassertion Timing
      8. 9.9.8  100Base-TX Transmit Timing (tR/F and Jitter)
      9. 9.9.9  100Base-TX Receive Packet Latency Timing
      10. 9.9.10 100Base-TX Receive Packet Deassertion Timing
      11. 9.9.11 10Mbs MII Transmit Timing
      12. 9.9.12 10Mb/s MII Receive Timing
      13. 9.9.13 10Base-T Transmit Timing (Start of Packet)
      14. 9.9.14 10Base-T Transmit Timing (End of Packet)
      15. 9.9.15 10Base-T Receive Timing (Start of Packet)
      16. 9.9.16 10Base-T Receive Timing (End of Packet)
      17. 9.9.17 10Mb/s Jabber Timing
      18. 9.9.18 10Base-T Normal Link Pulse Timing
      19. 9.9.19 Auto-Negotiation Fast Link Pulse (FLP) Timing
      20. 9.9.20 100Base-TX Signal Detect Timing
      21. 9.9.21 100Mbs Loopback Timing
      22. 9.9.22 10Mbs Internal Loopback Timing
      23. 9.9.23 RMII Transmit Timing
      24. 9.9.24 RMII Receive Timing
      25. 9.9.25 Isolation Timing
  10. 10Revision History

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Pin Descriptions

The TLK10x pins fall into the following interface categories (subsequent sections describe each interface):

  • Serial Management Interface
  • MAC Data Interface
  • Clock Interface
  • LED Interface
  • Reset and Power Down
  • Bootstrap Configuration Inputs
  • 10/100Mbs PMD Interface
  • Special Connect Pins
  • Power and Ground pins

Note: Configuration pin option. See Section 3.1 for Jumper Definitions.

The definitions below define the functionality of each pin.

Type: I Input Type: OD Open Drain
Type: O Output Type: PD, PU Internal Pulldown/Pullup
Type: I/O Input/Output Type: S Configuration Pin (All configuration pins have weak internal pullups or pulldowns. Use an external 2.2kΩ resistor if you need a different default value. See Section 3.1 for details.)

2.1 Pin Layout

TLK105 TLK106 po_tlk105_tlk106_llseb8.gifFigure 2-1 TLK10x PIN DIAGRAM, TOP VIEW

This document describes signals that take on different names depending on configuration. In such cases, the different names are placed together and separated by slash (/) characters. For example, "RXD_3 / PHYAD4". Active low signals are represented by overbars.

.

2.2 Serial Management Interface (SMI)

PIN TYPE DESCRIPTION
NAME NO.
MDC 20 I MANAGEMENT DATA CLOCK: Clock signal for the management data input/output (MDIO) interface. The maximum MDC rate is 25MHz; there is no minimum MDC rate. MDC is not required to be synchronous to the TX_CLK or the RX_CLK.
MDIO 19 I/O MANAGEMENT DATA I/O: Bidirectional command / data signal synchronized to MDC. Either the local controller or the TLK10x may drive the MDIO signal. This pin requires a pull-up resistor with value 2.2kΩ.

2.3 MAC Data Interface

PIN TYPE DESCRIPTION
NAME NO.
TX_CLK 2 O, PD

MII TRANSMIT CLOCK: MII Transmit Clock provides the 25MHz or 2.5MHz reference clock depending on the speed. Note that in MII mode, this clock has constant phase referenced to REF_CLK. Applications requiring such constant phase may use this feature.

Unused in RMII mode. In RMII, X1 reference clock is used as the clock for both transmit and receive.
TX_EN 3 I, PD TRANSMIT ENABLE: TX_EN is presented on the rising edge of the TX_CLK . TX_EN indicates the presence of valid data inputs on TXD[3:0] in MII mode, and on TXD [1:0] in the RMII mode. TX_EN is an active high signal.
TXD_0
TXD_1
TXD_2
TXD_3		 4
5
6
7		 I, PD TRANSMIT DATA: In MII mode, the transmit data nibble received from the MAC is synchronous to the rising edge of the TX_CLK signal. In RMII mode, TXD [1:0] received from the MAC is synchronous to the 50MHz reference clock on XI.
RX_CLK 25 O RECEIVE CLOCK: In MII mode it is the receive clock that provides either a 25MHz or 2.5MHz reference clock, depending on the speed, that is derived from the received data stream.
RX_DV / MII_MODE 26 S, O, PD RECEIVE DATA VALID: This pin indicates valid data is present on the RXD [3:0] for MII mode or on RXD [1:0] for RMII mode, independently from Carrier Sense.
RX_ER / AMDIX_EN 28 S, O, PU RECEIVE ERROR: This pin indicates that an error symbol has been detected within a received packet in both MII and RMII mode. In MII mode, RX_ER is asserted high synchronously to RX_CLK and in RMII mode, synchronously to XI (50MHz). This pin is not required to be used by the MAC, in either MII or RMII, because the PHY is corrupting data on a receive error.
RXD_0 / PHYAD1
RXD_1 / PHYAD2
RXD_2 / PHYAD3
RXD_3 / PHYAD4		 30
31
32
1		 S, O, PD RECEIVE DATA: Symbols received on the cable are decoded and presented on these pins synchronous to RX_CLK. They contain valid data when RX_DV is asserted. A nibble RXD [3:0] is received in the MII mode and 2-bits RXD[1:0] is received in the RMII Mode.

PHY address pins PHYAD[4:1] are multiplexed with RXD [3:0], and are pulled down. PHYAD0 (LSB of the address) is multiplexed with COL on pin 29, and is pulled up.

If no external pullup/pulldown is present, the default address is 0x01.
CRS / CRS_DV/ LED_CFG 27 S, O, PU

CARRIER SENSE: In MII mode this pin is asserted high when the receive medium is non-idle.

CARRIER SENSE/RECEIVE DATA VALID: In RMII mode, this pin combines the RMII Carrier and Receive Data Valid indications.
COL / PHYAD0 29 S, O, PU

COLLISION DETECT: For MII mode in Full Duplex Mode this pin is always low. In 10Base-T/100Base-TX half-duplex modes, this pin is asserted HIGH only when both transmit and receive media are non-idle. This pin is not used in RMII mode.

2.4 10Mbs and 100Mbs PMD Interface

PIN TYPE DESCRIPTION
NAME NO.
TD–, TD+ 11, 12 I/O Differential common driver transmit output (PMD Output Pair): These differential outputs are automatically configured to either 10Base-T or 100Base-TX signaling.

In Auto-MDIX mode of operation, this pair can be used as the Receive Input pair. These pins require 3.3V bias for operation.
RD–, RD+ 9, 10 I/O Differential receive input (PMD Input Pair): These differential inputs are automatically configured to accept either 100Base-TX or 10Base-T signaling.

In Auto-MDIX mode of operation, this pair can be used as the Transmit Output pair. These pins require 3.3V bias for operation.

2.5 Clock Interface

PIN TYPE DESCRIPTION
NAME NO.
XI 23 I CRYSTAL/OSCILLATOR INPUT:
MII reference clock: Reference clock. 25MHz ±50ppm-tolerance crystal reference or oscillator input. The device supports either an external crystal resonator connected across pins XI and XO, or an external CMOS-level oscillator source connected to pin XI only. When using an external CMOS-level oscillator, the oscillator must have the same voltage reference as the VDD_IO supply.
RMII reference clock: Primary clock reference input for the RMII mode. The input must be connected to a 50MHz ±50ppm-tolerance CMOS-level oscillator source. When using an external CMOS-level oscillator, the oscillator must have the same voltage reference as the VDD_IO supply. RMII is not supported with a 1.8V reference clock.
XO 22 O CRYSTAL OUTPUT: Reference Clock output. XO pin is used for crystal only. This pin should be left floating when an oscillator input is connected to XI.

2.6 LED Interface

(See Table 3-4 for LED Mode Selection)
PIN TYPE DESCRIPTION
NAME NO.
LED_LINK / AN_0 17 S, O, PU LED Pin to indicate status
Mode 1 LINK Indication LED: Indicates the status of the link. When the link is good, the LED is ON.
Mode 2 ACT indication LED: Indicates transmit and receive activity in addition to the status of the Link. The LED is ON when Link is good. The LED blinks when the transmitter or receiver is active.

2.7 Reset and Power Down

PIN TYPE DESCRIPTION
NAME NO.
RESET 18 I, PU This pin is an active-low reset input that initializes or re-initializes all the internal registers of the TLK10x. Asserting this pin low for at least 1µs will force a reset process to occur. All jumper options are reinitialized as well.
INT / PWDN 8 IO, OD, PU Register access is required for this pin to be configured either as power down or as an interrupt. The default function of this pin is power down.
When this pin is configured for a power down function, an active low signal on this pin places the device in power down mode.
When this pin is configured as an interrupt pin, then this pin is asserted low when an interrupt condition occurs. The pin has an open-drain output with a weak internal pull-up. Some applications may require an external pull-up resistor.

2.8 Power and Bias Connections

PIN TYPE DESCRIPTION
NAME NO.
RBIAS 16 I Bias Resistor Connection: Use a 4.87kΩ 1% resistor connected from RBIAS to GND.
PFBOUT 15 O Power Feedback Output: Place 10µf and 0.1μF capacitors (ceramic preferred) close to PFBOUT.
In single-supply operation, connect this pin to PFBIN1 and PFBIN2 (pin 13 and pin 24). See Figure 3-1 for proper placement.
In multiple supply operation, this pin is not used.
PFBIN1 13 I Power Feedback Input: These pins are fed with power from PFBOUT (pin 15) in single supply operation.
PFBIN2 24 In multiple supply operation, connect a 1.55V external power supply to these pins. Connect a small capacitor of 0.1µF close to each pin. To power down the internal linear regulator, write to register 0x00d0.
VDD_IO 21 P I/O 3.3V, 2.5V, or 1.8V Supply - For details, see Section 3.2.3
AVDD33 14 P Analog 3.3V power supply
GND Ground Pad P Ground Pad