SGLS307Q July   2006  – August 2024 TLK2711-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 TTL Input Electrical Characteristics
    6. 5.6 Transmitter/Receiver Electrical Characteristics
    7. 5.7 Reference Clock (TXCLK) Timing Requirements
    8. 5.8 TTL Output Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Transmit Interface
      2. 6.3.2  Transmit Data Bus
      3. 6.3.3  Data Transmission Latency
      4. 6.3.4  8-Bit/10-Bit Encoder
      5. 6.3.5  Pseudo-Random Bit Stream (PRBS) Generator
      6. 6.3.6  Parallel to Serial
      7. 6.3.7  High-Speed Data Output
      8. 6.3.8  Receive Interface
      9. 6.3.9  Receive Data Bus
      10. 6.3.10 Data Reception Latency
      11. 6.3.11 Serial to Parallel
      12. 6.3.12 Comma Detect and 8-Bit/10-Bit Decoding
      13. 6.3.13 LOS Detection
      14. 6.3.14 PRBS Verification
      15. 6.3.15 Reference Clock Input
      16. 6.3.16 Operating Frequency Range
      17. 6.3.17 Testability
      18. 6.3.18 Loopback Testing
      19. 6.3.19 BIST
      20. 6.3.20 Power-On Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Mode
      2. 6.4.2 High-Speed I/O Directly-Coupled Mode
      3. 6.4.3 High-Speed I/O AC-Coupled Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision P (February 2017) to Revision Q (August 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Changed Device Information table to Package Information Go
  • Changed thermal metric values in the Thermal Information sectionGo
  • Removed CFP package footnote about thermal land pad requirements in Thermal Information sectionGo

Changes from Revision O (March 2016) to Revision P (February 2017)

  • Changed column header of Table 6-4 indicating correct order of receive data bus bitsGo

Changes from Revision N (December 2015) to Revision O (March 2016)

  • Changed reference to table note (2) Internal 10-kΩ pulldown for TKLSB and TKMSBGo

Changes from Revision M (October 2014) to Revision N (December 2015)

  • Updated the frequency range of TXCLK Go
  • Updated Handling Ratings table to an ESD Ratings table and moved Tstg to the Absolute Maximum Ratings tableGo

Changes from Revision L (August 2014) to Revision M (October 2014)

Changes from Revision K (July 2014) to Revision L (August 2014)

  • Updated Power-On/Reset Timing Diagram optionsGo

Changes from Revision J (May 2014) to Revision K (July 2014)

  • Updated pin description for ENABLEGo
  • Updated pin voltages in Absolute Maximum Ratings Go
  • Added more information to Power-On Reset detailing two power-on/reset timing options Go

Changes from Revision I (January 2014) to Revision J (April 2014)

Changes from Revision H (December 2013) to Revision I (January 2014)

  • Added /EM bullet to Features Go