SGLS307Q July   2006  – August 2024 TLK2711-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 TTL Input Electrical Characteristics
    6. 5.6 Transmitter/Receiver Electrical Characteristics
    7. 5.7 Reference Clock (TXCLK) Timing Requirements
    8. 5.8 TTL Output Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Transmit Interface
      2. 6.3.2  Transmit Data Bus
      3. 6.3.3  Data Transmission Latency
      4. 6.3.4  8-Bit/10-Bit Encoder
      5. 6.3.5  Pseudo-Random Bit Stream (PRBS) Generator
      6. 6.3.6  Parallel to Serial
      7. 6.3.7  High-Speed Data Output
      8. 6.3.8  Receive Interface
      9. 6.3.9  Receive Data Bus
      10. 6.3.10 Data Reception Latency
      11. 6.3.11 Serial to Parallel
      12. 6.3.12 Comma Detect and 8-Bit/10-Bit Decoding
      13. 6.3.13 LOS Detection
      14. 6.3.14 PRBS Verification
      15. 6.3.15 Reference Clock Input
      16. 6.3.16 Operating Frequency Range
      17. 6.3.17 Testability
      18. 6.3.18 Loopback Testing
      19. 6.3.19 BIST
      20. 6.3.20 Power-On Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Mode
      2. 6.4.2 High-Speed I/O Directly-Coupled Mode
      3. 6.4.3 High-Speed I/O AC-Coupled Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.