SLOS890C October   2015  – December 2019 TLV1701-Q1 , TLV1702-Q1 , TLV1704-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      TLV1702-Q1 as a Window Comparator
      2.      Stable Propagation Delay vs Temperature
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Comparator Inputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Setting Reference Voltage
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TLV1701-Q1 TLV1702-Q1 TLV1704-Q1 UNIT
DBV (SOT-23) DCK (SC-70) DGK (VSSOP) PW (TSSOP)
5 PINS 5 PINS 8 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 233.1 222.5 199 128.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 156.4 137.2 89.5 56.5 °C/W
RθJB Junction-to-board thermal resistance 60.6 71.3 120.4 69.9 °C/W
ψJT Junction-to-top characterization parameter 35.7 44.6 22 9.1 °C/W
ψJB Junction-to-board characterization parameter 59.7 71.0 118.7 69.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.