SNOSDI4 March   2024 TLV1872

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Configurations: TLV1871 Single
    2.     Pin Configurations: TLV1872 Dual
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Separate Power Supplies
      2. 6.4.2 Power-On Reset (POR)
      3. 6.4.3 Inputs
        1. 6.4.3.1 Rail-to-Rail Inputs
        2. 6.4.3.2 Unused Inputs
      4. 6.4.4 Push-Pull Output
      5. 6.4.5 ESD Protection
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 Hysteresis
    2. 7.2 Typical Applications
      1. 7.2.1 Accurate Bipolar Zero-Cross Detector
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Performance Plots
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) TLV1871 TLV1872 UNIT
DDF
(SOT-23)		 DGS
(WSON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance – 151.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance – 55.0 °C/W
RθJB Junction-to-board thermal resistance – 84.9 °C/W
ψJT Junction-to-top characterization parameter – 3.2 °C/W
ψJB Junction-to-board characterization parameter – 83.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – – °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.