SNOSDG9 December   2024 TLV1922

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Configuration: TLV1921
    2.     Pin Configurations: TLV1922
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information - Single
    4. 5.4 Thermal Information - Dual
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
        1. 6.4.1.1 Input Voltage and Common Mode Voltage Ranges
        2. 6.4.1.2 Fail-Safe Inputs
        3. 6.4.1.3 Unused Inputs
      2. 6.4.2 Open-Drain Output
      3. 6.4.3 Reference Output
      4. 6.4.4 Power-On Reset (POR)
      5. 6.4.5 Internal Hysteresis
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 Hysteresis
        1. 7.1.2.1 Inverting and Non-Inverting Hysteresis using Open-Drain Output
    2. 7.2 Typical Applications
      1. 7.2.1 Window Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information - Dual

THERMAL METRIC(1) TLV1922 UNIT
D
(SOIC-8)		 DSG
(WSON-8)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance – 78.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance – 99.8 °C/W
RθJB Junction-to-board thermal resistance – 44.4 °C/W
ψJT Junction-to-top characterization parameter – 5.0 °C/W
ψJB Junction-to-board characterization parameter – 44.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - 19.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.