SBOS782A November   2016  – May 2018 TLV170 , TLV2170 , TLV4170

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Smallest Packaging for 36-V Operational Amplifiers
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: TLV170
    2.     Pin Functions: TLV2170
    3.     Pin Functions: TLV4170
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: TLV170
    5. 6.5 Thermal Information: TLV2170
    6. 6.6 Thermal Information: TLV4170
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics: Table of Graphs
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Electrical Overstress
      4. 7.3.4 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Common-Mode Voltage Range
      2. 7.4.2 Overload Recovery
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 DIP Adapter EVM
        3. 11.1.1.3 Universal Op Amp EVM
        4. 11.1.1.4 TI Precision Designs
        5. 11.1.1.5 WEBENCH Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLVx170 family of electromagnetic interference (EMI)-hardened, 36-V, single-supply, low-noise operational amplifiers (op amps) have a THD+N of 0.0002% at 1 kHz and can operate on supplies that range from 2.7 V (±1.35 V) to 36 V (±18V). These features, along with low noise and very high power-supply rejection ratio (PSRR), make the single-channel TLV170, dual-channel TLV2170, and quad-channel TLV4170 suitable for use in microvolt-level signal amplification. The TLVx170 family of devices also gives good offset, drift, and bandwidth with low quiescent current.

Unlike most op amps that are specified at only one supply voltage, the TLVx170 family of op amps is specified from 2.7 V to 36 V with the ability to swing input signals beyond the supply rails without phase reversal. The TLVx170 family is also unity-gain stable with a 200-pF capacitive load with a 1.2-MHz bandwidth and a 0.4-V/μs slew rate for use in current-to-voltage converters.

The device inputs can operate 100 mV below the negative rail and within 2 V of the positive rail for normal operation, and with full rail-to-rail input with reduced performance. The TLVx170 devices are specified from –40°C to +125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV170 SOIC (8) 4.90 mm × 3.91 mm
SOT-23 (5) 2.90 mm × 1.60 mm
TLV2170 SOIC (8) 4.90 mm × 3.91 mm
VSSOP (8) 3.00 mm × 3.00 mm
TLV4170 SOIC (14) 8.65 mm × 3.91 mm
TSSOP (14) 5.00 mm × 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.