SBOS947A July   2019  – June 2020 TLV2186

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      High-Side Current Shunt Monitor Application
      2.      VOS vs Input Common Mode Voltage
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rail-to-Rail Inputs
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Input Bias Current Clock Feedthrough
      4. 7.3.4 EMI Rejection
        1. 7.3.4.1 EMIRR +IN Test Configuration
      5. 7.3.5 Electrical Overstress
      6. 7.3.6 MUX-Friendly Inputs
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Noise Calculations
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Current Sensing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Bridge Amplifier
      3. 8.2.3 Low-Side Current Monitor
      4. 8.2.4 RTD Amplifier With Linearization
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

D Package
8-Pin SOIC
Top View
TLV2186 DAPPER_Dual_DIP.gif
DSG Package
8-Pin WSON With Exposed Thermal Pad
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
–IN A 2 I Inverting input channel A
+IN A 3 I Noninverting input channel A
–IN B 6 I Inverting input channel B
+IN B 5 I Noninverting input channel B
OUT A 1 O Output channel A
OUT B 7 O Output channel B
V– 4 — Negative supply
V+ 8 — Positive supply
Thermal Pad — — Exposed thermal die pad on underside; connect thermal die pad to V–.