SBOS751 December   2015 TLV2333 , TLV333 , TLV4333

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TLV333
    5. 7.5 Thermal Information: TLV2333
    6. 7.6 Thermal Information: TLV4333
    7. 7.7 Electrical Characteristics: VS = 1.8 V to 5.5 V
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Input Voltage
      3. 8.3.3 Internal Offset Correction
      4. 8.3.4 Achieving Output Swing to the Op Amp Negative Rail
      5. 8.3.5 Input Differential Voltage
      6. 8.3.6 EMI Susceptibility and Input Filtering
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 General Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 System Examples

Figure 21 shows the basic configuration for a bridge amplifier.

A low-side current shunt monitor is shown in Figure 22.

TLV333 TLV2333 TLV4333 ai_amp_bridge_bos682.gif Figure 21. Single Op Amp Bridge Amplifier
TLV333 TLV2333 TLV4333 ai_monitor_lo_side_bos682.gif

NOTE:

1% resistors provide adequate common-mode rejection at small ground-loop errors.
Figure 22. Low-Side Current Monitor

RN are operational resistors used to isolate the ADS1100 from the noise of the digital I2C bus. Because the ADS1100 is a 16-bit converter, a precise reference is essential for maximum accuracy. If absolute accuracy is not required, and the 5-V power supply is sufficiently stable, the REF3130 can be omitted.

Figure 23 shows the TLV333 in a typical thermistor circuit.

TLV333 TLV2333 TLV4333 ai_thermistor_msrmt_bos682.gif Figure 23. Thermistor Measurement