TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown
- SLOS270F March 2001 – August 2016 TLV2370 , TLV2371 , TLV2372 , TLV2373 , TLV2374 , TLV2375
  
  PRODUCTION DATA.

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DATA SHEET

TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown

1 Features

Rail-to-Rail Input and Output
Wide Bandwidth: 3 MHz
High Slew Rate: 2.4 V/μs
Supply Voltage Range: 2.7 V to 16 V
Supply Current: 550 μA/Channel
Low-Power Shutdown Mode
- I_DD(SHDN): 25 μA/Channel
Input Noise Voltage: 39 nV/√Hz
Input Bias Current: 1 pA
Specified Temperature Range:
- −40°C to +125°C (Industrial Grade)
Ultra-Small Packaging:
- 5- or 6-Pin SOT-23 (TLV2370, TLV2371)
- 8- or 10-Pin MSOP (TLV2372, TLV2373)

2 Applications

White Goods
Handheld Test Equipment
Portable Blood Glucose Systems
Remote Sensing
Active Filters
Industrial Automation
Battery-Powered Electronics

Operational Amplifier

TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 op_amp_slos270.gif

3 Description

The TLV237x single-supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only 550 μA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8-V supplies down to ±1.35 V) a variety of rechargeable cells.

The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products available from TI, and it is the first to allow operation up to 16-V rails with good ac performance.

All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.

The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power microcontrollers available today including TI’s MSP430.

Device Information⁽¹⁾

PART NUMBER	PACKAGE	BODY SIZE (NOM)
TLV237x	PDIP (8)	9.81 mm × 6.35 mm
	PDIP (14)	19.30 mm × 6.35 mm
	SOIC (8)	4.90 mm × 3.91 mm
	SOIC (14)	8.65 mm × 3.91 mm
	TSSOP (14)	5.00 mm × 4.40 mm
	TSSOP (16)	5.00 mm × 4.40 mm
	SOT-23 (6)	2.90 mm × 1.60 mm
	SOT-23 (5)	2.90 mm × 1.60 mm
	VSSOP (8)	3.00 mm × 3.00 mm
	VSSOP (10)	3.00 mm × 3.00 mm

For all available packages, see the orderable addendum at the end of the data sheet.

4 Revision History

Changes from E Revision (May 2016) to F Revision

Changed names of pins 2 and 3 in TLV2372 D, DGK, and P packages pinout diagramGo

Changes from D Revision (January 2005) to E Revision

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
Deleted TLV2370 and TLV2371 Available Options, TLV2372 AND TLV2373 Available Options, and TLV2374 and TLV2375 Available Options tablesGo
Deleted Continuous total power dissipation and lead temperature specifications from Absolute Maximum Ratings tableGo
Deleted Dissipation Ratings table Go

5 Device Comparison Tables

Table 1. Selection of Signal Amplifier Products⁽¹⁾

DEVICE	V_DD (V)	V_IO (µV)	I_Q/Ch (µA)	I_IB (pA)	GBW (MHz)	SR (V/µs)	SHUTDOWN	RAIL-TO-RAIL	SINGLES, DUALS, QUADS
TLV237x	2.7 to 16	500	550	1	3	2.4	Yes	I/O	S, D, Q
TLC227x	4 to 16	300	1100	1	2.2	3.6	—	O	D, Q
TLV27x	2.7 to 16	500	550	1	3	2.4	—	O	S, D, Q
TLC27x	3 to 16	1100	675	1	1.7	3.6	—	—	S, D, Q
TLV246x	2.7 to 16	150	550	1300	6.4	1.6	Yes	I/O	S, D, Q
TLV247x	2.7 to 16	250	600	2	2.8	1.5	Yes	I/O	S, D, Q
TLV244x	2.7 to 10	300	725	1	1.8	1.4	—	O	D, Q

(1) Typical values measured at 5 V and 25°C.

Table 2. Family Package Table⁽¹⁾

DEVICE	NUMBER OF CHANNELS	PACKAGE TYPES					SHUTDOWN	UNIVERSAL EVM BOARD
DEVICE	NUMBER OF CHANNELS	PDIP	SOIC	SOT-23	TSSOP	MSOP	SHUTDOWN	UNIVERSAL EVM BOARD
TLV2370	1	8	8	6	—	—	Yes	See the EVM Selection Guide
TLV2371	1	8	8	5	—	—	—
TLV2372	2	8	8	—	—	8	—
TLV2373	2	14	14	—	—	10	Yes
TLV2374	4	14	14	—	14	—	—
TLV2375	4	16	16	—	16	—	Yes

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.