SGLS244B May   2004  – December 2016 TLV2371-Q1 , TLV2372-Q1 , TLV2374-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TLV2371-Q1
    5. 7.5 Thermal Information: TLV2372-Q1
    6. 7.6 Thermal Information: TLV2374-Q1
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Rail-to-Rail Input Operation
      2. 8.3.2 Driving a Capacitive Load
      3. 8.3.3 Offset Voltage
      4. 8.3.4 General Configurations
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Side Current Monitor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Differential Amplifier Equations
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Inverting Amplifier
      3. 9.2.3 Design Requirements
      4. 9.2.4 Detailed Design Procedure
      5. 9.2.5 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
    3. 11.3 Power Dissipation Considerations
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (June 2008) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted 8-Pin MSOP (TLV2372) because the TLV2372-Q1 is not available in MSOP; also removed all references throughout the data sheetGo
  • Changed list items in Applications Go
  • Removed Family Package and Available Options tables, see POA at the end of the data sheet Go
  • Renamed Selection of Signal Amplifier Products table toDevice Comparison TableGo
  • Changed SHUTDOWN for the TLV237x in the Device Comparison Table From: Yes To: —Go
  • Changed IIB (pA) for the TLV246x in the Device Comparison Table From: 1300 To: 1.3Go
  • Changed SHUTDOWN for the TLV237x in the Device Comparison Table From: Yes To: —Go
  • Changed GND DESCRIPTION in Pin Functions: TLV2371-Q1 From: Ground connection To: Negative (lowest) power supplyGo
  • Changed GND DESCRIPTION in Pin Functions: TLV2372-Q1 From: Ground connection To: Negative (lowest) power supplyGo
  • Removed Typical Pin 1 Indicators image Go
  • Changed GND DESCRIPTION in Pin Functions: TLV2374-Q1 From: Ground connection To: Negative (lowest) power supplyGo
  • Deleted Lead temperature (260°C maximum)Go
  • Added additional thermal values to all Thermal Information tablesGo
  • Changed RθJA values in Thermal Information: TLV2371-Q1 From: 325.1 To: 228.5 (DBV) and From: 176 To: 138.4 (D)Go
  • Changed RθJA value in Thermal Information: TLV2372-Q1 From: 176 To: 138.4 (D)Go
  • Deleted entire DGK (MSOP) column from Thermal Information: TLV2372-Q1Go
  • Changed RθJA values in Thermal Information: TLV2374-Q1 From: 122.3 To: 67 (D) and From: 173.6 To: 121 (PW)Go
  • Deleted Maximum Power Dissipation vs Free-Air Temperature graphGo