SGLS008G March   2003  – February 2018 TLV2460A-Q1 , TLV2461A-Q1 , TLV2462-Q1 , TLV2462A-Q1 , TLV2463A-Q1 , TLV2464A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: TLV2460x-Q1
    5. 6.5  Thermal Information: TLV2461x-Q1
    6. 6.6  Thermal Information: TLV2462-Q1
    7. 6.7  Thermal Information: TLV2462A-Q1
    8. 6.8  Thermal Information: TLV2463x-Q1
    9. 6.9  Electrical Characteristics: VDD = 3 V
    10. 6.10 Electrical Characteristics: VDD = 5 V
    11. 6.11 Operating Characteristics: VDD = 3 V
    12. 6.12 Operating Characteristics: VDD = 5 V
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Driving a Capacitive Load
      2. 8.3.2 Offset Voltage
      3. 8.3.3 General Configurations
      4. 8.3.4 General Power Dissipation Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Macromodel Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • PW|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.4 General Power Dissipation Considerations

For a given θJA value, the maximum power dissipation is shown in Figure 53 and is calculated by Equation 1:

Equation 1. TLV2460-Q1 TLV2460A-Q1 TLV2461-Q1 TLV2461A-Q1 TLV2462-Q1 TLV2462A-Q1 TLV2463-Q1 TLV2463A-Q1 TLV2464A-Q1 appinfo_eq_pd_gls008.gif

where

  • PD = Maximum power dissipation of TLV246x-Q1 (watts)
  • TMAX = Absolute maximum junction temperature (150°C)
  • TA = Ambient free-air temperature (°C)
  • θJA = θJC + θCA
  • θJC = Thermal coefficient from junction to case
  • θCA = Thermal coefficient from case to ambient air (°C/W)
TLV2460-Q1 TLV2460A-Q1 TLV2461-Q1 TLV2461A-Q1 TLV2462-Q1 TLV2462A-Q1 TLV2463-Q1 TLV2463A-Q1 TLV2464A-Q1 appinfo_mxpwrdiss_ta_gls008.gifFigure 53. Maximum Power Dissipation vs Free-Air Temperature