SGLS008G March   2003  – February 2018 TLV2460A-Q1 , TLV2461A-Q1 , TLV2462-Q1 , TLV2462A-Q1 , TLV2463A-Q1 , TLV2464A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: TLV2460x-Q1
    5. 6.5  Thermal Information: TLV2461x-Q1
    6. 6.6  Thermal Information: TLV2462-Q1
    7. 6.7  Thermal Information: TLV2462A-Q1
    8. 6.8  Thermal Information: TLV2463x-Q1
    9. 6.9  Electrical Characteristics: VDD = 3 V
    10. 6.10 Electrical Characteristics: VDD = 5 V
    11. 6.11 Operating Characteristics: VDD = 3 V
    12. 6.12 Operating Characteristics: VDD = 5 V
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Driving a Capacitive Load
      2. 8.3.2 Offset Voltage
      3. 8.3.3 General Configurations
      4. 8.3.4 General Power Dissipation Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Macromodel Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGK|8
  • PW|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (December 2015) to G Revision

  • Updated data sheet text to latest data sheet and translation standardsGo
  • Deleted "Input Offset Voltage: 100 µV" bullet from Features section Go
  • Deleted "Universal Operational Amplifier EVM" bullet from Features section Go
  • Deleted TLV2464 device from documentGo
  • Deleted Device Comparison table Go
  • Reformatted Thermal Information tables and table notes Go
  • Changed IIO and IIB unit from pA to nA in Electrical Characteristics: VDD = 3 V tableGo
  • Changed IIO and IIB unit from pA to nA in Electrical Characteristics: VDD = 5 V tableGo
  • Reformatted document references in Related Documentation section Go

Changes from E Revision (October 2012) to F Revision

  • Added AEC-Q100 bulleted items Go
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted D package from TLV2460-Q1, TLV2461-Q1, TLV2463-Q1, and TLV2464A-Q1 and added TLV246xA-Q1 device number to pin drawingsGo
  • Deleted table note 3 reference to JESD 51-5 from Absolute Maximum Ratings tableGo

Changes from D Revision (September 2010) to E Revision

  • Changed device names from TLV246xx to TLV246xx-Q1 throughout document.Go
  • Changed IDD unit from µA to mA. Go
  • Changed IDD unit from µA to mAGo