SGLS008G March   2003  – February 2018 TLV2460A-Q1 , TLV2461A-Q1 , TLV2462-Q1 , TLV2462A-Q1 , TLV2463A-Q1 , TLV2464A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: TLV2460x-Q1
    5. 6.5  Thermal Information: TLV2461x-Q1
    6. 6.6  Thermal Information: TLV2462-Q1
    7. 6.7  Thermal Information: TLV2462A-Q1
    8. 6.8  Thermal Information: TLV2463x-Q1
    9. 6.9  Electrical Characteristics: VDD = 3 V
    10. 6.10 Electrical Characteristics: VDD = 5 V
    11. 6.11 Operating Characteristics: VDD = 3 V
    12. 6.12 Operating Characteristics: VDD = 5 V
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Driving a Capacitive Load
      2. 8.3.2 Offset Voltage
      3. 8.3.3 General Configurations
      4. 8.3.4 General Power Dissipation Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Macromodel Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • PW|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.1 Macromodel Information

Macromodel information provided was derived using Microsim Parts™ Release 8, the model generation software used with Microsim PSpice™. The Boyle macromodel (1) and subcircuit in Figure 54 are generated using the TLV246x-Q1 typical electrical and operating characteristics at TA = 25°C. Using this information, output simulations of the following key parameters are generated to a tolerance of 20% (in most cases):

1. G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers,” IEEE Journal of Solid-State Circuits, SC-9, 353 (1974).

  • Maximum positive output voltage swing
  • Maximum negative output voltage swing
  • Slew rate
  • Quiescent power dissipation
  • Input bias current
  • Open-loop voltage amplification
  • Unity gain frequency
  • Common-mode rejection ratio
  • Phase margin
  • DC output resistance
  • AC output resistance
  • Short-circuit output current limit
TLV2460-Q1 TLV2460A-Q1 TLV2461-Q1 TLV2461A-Q1 TLV2462-Q1 TLV2462A-Q1 TLV2463-Q1 TLV2463A-Q1 TLV2464A-Q1 appinfo_boylemacro_gls008.gifFigure 54. Boyle Macromodel and Sub-Circuit