SGLS008G March 2003 – February 2018 TLV2460A-Q1 , TLV2461A-Q1 , TLV2462-Q1 , TLV2462A-Q1 , TLV2463A-Q1 , TLV2464A-Q1
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TLV2461x-Q1 | UNIT | |
---|---|---|---|
PW (TSSOP) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 185.7 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 69 | °C/W |
RθJB | Junction-to-board thermal resistance | 114.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 9.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 112.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |