SLAS579A April   2009  – June 2015 TLV2553-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  External Reference Specifications
    7. 6.7  Operating Characteristics
    8. 6.8  Timing Requirements, VREF+ = 5 V
    9. 6.9  Timing Requirements, VREF+ = 2.5 V
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Converter Operation
        1. 8.3.1.1 Data I/O Cycle
        2. 8.3.1.2 Sampling Cycle
        3. 8.3.1.3 Conversion Cycle
      2. 8.3.2  Power Up and Initialization
      3. 8.3.3  Data Input
      4. 8.3.4  Data Input - Address/Command Bits
      5. 8.3.5  Data Output Length
      6. 8.3.6  LSB Out First
      7. 8.3.7  Bipolar Output Format
      8. 8.3.8  Reference
      9. 8.3.9  EOC Output
      10. 8.3.10 Chip-Select Input (CS)
      11. 8.3.11 Power-Down Features
      12. 8.3.12 Analog MUX
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (April 2009) to A Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added PW package Go
  • Added Thermal InformationGo