SBOSAG5 December   2024  – December 2024 TLV2888

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: TLV2888
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Common-Mode Range
      2. 6.3.2 Phase-Reversal Protection
      3. 6.3.3 Chopping Transients
      4. 6.3.4 EMI Rejection
      5. 6.3.5 Electrical Overstress
      6. 6.3.6 MUX-Friendly Inputs
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Noise Calculations
    2. 7.2 Typical Applications
      1. 7.2.1 High-Side Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Programmable Current Source
      3. 7.2.3 Programmable Current Source For A Grounded Load
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLV888, TLV2888, and TLV4888 (TLVx888) are wide-bandwidth, low noise, zero-drift operational amplifiers (op amps). These op amps feature only 15µV of offset voltage (max) and 0.1µV/°C of offset voltage drift (max) over a wide temperature range.

The TLVx888 feature very fast settling time due in part to the wide gain bandwidth and very high slew rate. The settling time is further enhanced in multichannel systems by the proprietary MUX-friendly input architecture.

The combination of high precision, fast settling, and low noise make the TLVx888 an excellent choice for a wide range of applications, including signal measurement, precision instrumentation, and data acquisition.

The TLVx888 are available in industry standard packages as well as micro-size packages to fit in the most space constrained applications. The devices are specified for operation from –40°C to +125°C.

Device Information
PART NUMBER CHANNEL COUNT PACKAGE(1)
TLV888(2) Single D (SOIC, 8)
DBV (SOT-23, 5)
DRL (SOT, 5)
TLV2888 Dual D (SOIC, 8)
DDF (SOT-23, 8)(2)
DGK (VSSOP-8)(2)
DSG (WSON-8)(2)
TLV4888(2) Quad D (SOIC, 14)
PW (TSSOP-14)
(1) For more information, see Section 10.
(2) Preview information (not Advance Information).

 

TLV2888 High-Side Current Shunt Monitor Application High-Side Current Shunt Monitor Application