SBOSAG5 December   2024  – December 2024 TLV2888

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: TLV2888
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Common-Mode Range
      2. 6.3.2 Phase-Reversal Protection
      3. 6.3.3 Chopping Transients
      4. 6.3.4 EMI Rejection
      5. 6.3.5 Electrical Overstress
      6. 6.3.6 MUX-Friendly Inputs
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Noise Calculations
    2. 7.2 Typical Applications
      1. 7.2.1 High-Side Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Programmable Current Source
      3. 7.2.3 Programmable Current Source For A Grounded Load
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

For best operational performance of the device, use good PCB layout practices:

  • For the lowest offset voltage, avoid temperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from connecting dissimilar conductors. Also:
    • Use low thermoelectric-coefficient conditions (avoid dissimilar metals).
    • Thermally isolate components from power supplies or other heat sources.
    • Shield operational amplifier and input circuitry from air currents, such as cooling fans.
  • Noise can propagate into analog circuitry through the power pins of the op amp and the circuit as a whole. Bypass capacitors reduce the coupled noise by providing low-impedance power sources local to the analog circuitry.
    • Connect low-ESR, 0.1µF ceramic bypass capacitors between each supply pin and ground, placed as close as possible to the device. A single bypass capacitor from V+ to ground is applicable for single-supply applications.
  • Separate grounding for analog and digital portions of circuitry is one of the simplest and most effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Physically separate digital and analog grounds paying attention to the flow of the ground current. For more detailed information, see the The PCB is a component of op amp design analog application journal.
  • To reduce parasitic coupling, run the input traces as far away as possible from the supply or output traces. If these traces cannot be separated, cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace.
  • Place the external components as close as possible to the device. As Figure 7-9 shows, keep the feedback resistor (R3) and gain resistor (R4) close to the inverting input to minimize parasitic capacitance.
  • Keep the length of input traces as short as possible. Short traces to the inverting input help to minimize parasitic capacitance on the inverting input. Always remember that the input traces are the most sensitive part of the circuit.
  • For best performance, clean the PCB following board assembly.
  • Any precision integrated circuit can experience performance shifts due to moisture ingress into the plastic package. Following any aqueous PCB cleaning process, bake the PCB assembly to remove moisture introduced into the device packaging during the cleaning process. A low-temperature, post-cleaning bake at 85°C for 30 minutes is sufficient for most circumstances.