SBOS300C february   2004  – april 2023 TLV3011 , TLV3011B , TLV3012 , TLV3012B

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings- TLV3011 and TLV3012
    2. 6.2  Absolute Maximum Ratings - TLV3011B and TLV3012B
    3. 6.3  ESD Ratings
    4. 6.4  Thermal Information - TLV3011 and TLV3012
    5. 6.5  Thermal Information- TLV3011B and TLV3012B
    6. 6.6  Recommended Operating Conditions
    7. 6.7  Electrical Characteristics - TLV3011 and TLV3012
    8. 6.8  Switching Characteristics - TLV3011 and TLV3012
    9. 6.9  Electrical Characteristics - TLV3011B and TLV3012B
    10. 6.10 Switching Characteristics - TLV3011B and TLV3012B
  7. 7 Typical Characteristics - TLV3011 and TLV3012
  8. 8 Typical Characteristics - TLV3011B and TLV3012B
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
      1. 9.4.1 Open Drain Output (TLV3011 and TLV3011B)
      2. 9.4.2 Push-Pull Output (TLV3012 and TLV3012B)
      3. 9.4.3 Voltage Reference
      4. 9.4.4 TLV3011B and TLV3012B Fail-Safe inputs
      5. 9.4.5 TLV3011B and TLV3012B Power On Reset
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 External Hysteresis
      2. 10.1.2 TLV3011B and TLV3012B Hysteresis
    2. 10.2 Typical Application
      1. 10.2.1 Under-Voltage Detection
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
    3. 10.3 System Examples
      1. 10.3.1 Power-On Reset
      2. 10.3.2 Relaxation Oscillator
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.