SGLS349A october   2006  – may 2023 TLV3011-EP , TLV3012-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings - TLV3011-EP
    2. 6.2  Absolute Maximum Ratings - TLV3012-EP
    3. 6.3  ESD Ratings
    4. 6.4  Thermal Resistance Characteristics
    5. 6.5  Recommended Operating Conditions - TLV3011-EP
    6. 6.6  Recommended Operating Conditions - TLV3012-EP
    7. 6.7  Electrical Characteristics - TLV3011-EP
    8. 6.8  Electrical Characteristics - TLV3012-EP
    9. 6.9  Switching Characteristics - TLV3012-EP
    10. 6.10 Typical Characteristics - TLV3011-EP
    11. 6.11 Typical Characteristics - TLV3012-EP
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open Drain Output (TLV3011-EP)
      2. 7.4.2 Push Pull Output (TLV3012-EP)
      3. 7.4.3 Voltage Reference
      4. 7.4.4 Fail-Safe Input (TLV3012-EP Only)
      5. 7.4.5 Power-On Reset (POR) (TLV3012-EP Only)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Hysteresis
    2. 8.2 Typical Application
      1. 8.2.1 Under Voltage Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.