SBOS561C March   2012  – May 2024 TLV3201 , TLV3202

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions: TLV3201
    2.     Pin Functions: TLV3202
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VCC = 5V
    6. 6.6 Switching Characteristics: VCC = 5V
    7. 6.7 Electrical Characteristics: VCC = 2.7V
    8. 6.8 Switching Characteristics: VCC = 2.7V
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Overvoltage Protection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Comparator Inputs
      2. 8.1.2 External Hysteresis
        1. 8.1.2.1 Inverting Comparator with Hysteresis
        2. 8.1.2.2 Noninverting Comparator With Hysteresis
      3. 8.1.3 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 TLV3201 Configured as an AC-Coupled Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 TLV3201 and OPA320 Configured as a Fast-Response Output Current Monitor
      3. 8.2.3 TLV3201 and TMP20 Configured as a Precision Analog Temperature Switch
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ (Free Software Download)
        2. 9.1.1.2 Universal Op Amp EVM
        3. 9.1.1.3 TI Precision Designs
        4. 9.1.1.4 WEBENCH Filter Designer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TLV3201 TLV3202 UNIT
DBV
(SOT-23)		 DCK
(SC70)		 D
(SOIC)		 DGK
(VSSOP)
5 PINS 5 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 237.8 281.9 143.6 201.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 108.7 97.6 97.2 92.5 °C/W
RθJB Junction-to-board thermal resistance 64.1 68.3 84.2 123.3 °C/W
ψJT Junction-to-top characterization parameter 12.1 2.6 45.5 23.0 °C/W
ψJB Junction-to-board characterization parameter 63.3 67.3 83.7 212.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.