SLAS548D October   2008  – September 2015 TLV320ADC3001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Dissipation Ratings
    7. 8.7  I2S/LJF/RJF Timing in Master Mode
    8. 8.8  DSP Timing in Master Mode
    9. 8.9  I2S/LJF/RJF Timing in Slave Mode
    10. 8.10 DSP Timing in Slave Mode
    11. 8.11 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Hardware Reset
      2. 10.3.2  PLL Start-up
      3. 10.3.3  Software Power Down
      4. 10.3.4  miniDSP
      5. 10.3.5  Audio Data Converters
      6. 10.3.6  Digital Audio Data Serial Interface
        1. 10.3.6.1 Right-Justified Mode
        2. 10.3.6.2 Left-Justified Mode
        3. 10.3.6.3 I2S Mode
        4. 10.3.6.4 DSP Mode
      7. 10.3.7  Audio Clock Generation
      8. 10.3.8  Stereo Audio ADC
      9. 10.3.9  Audio Analog Inputs
        1. 10.3.9.1 Digital Volume Control
        2. 10.3.9.2 Fine Digital Gain Adjustment
        3. 10.3.9.3 AGC
      10. 10.3.10 Input Impedance and VCM Control
      11. 10.3.11 MICBIAS Generation
      12. 10.3.12 ADC Decimation Filtering and Signal Processing
        1. 10.3.12.1 Processing Blocks
        2. 10.3.12.2 Processing Blocks - Details
          1. 10.3.12.2.1 First-Order IIR, AGC, Filter A
          2. 10.3.12.2.2 Five Biquads, First-Order IIR, AGC, Filter A
          3. 10.3.12.2.3 25-Tap FIR, First-Order IIR, AGC, Filter A
          4. 10.3.12.2.4 First-Order IIR, AGC, Filter B
          5. 10.3.12.2.5 Three Biquads, First-Order IIR, AGC, Filter B
          6. 10.3.12.2.6 20-Tap FIR, First-Order IIR, AGC, Filter B
          7. 10.3.12.2.7 First-Order IIR, AGC, Filter C
          8. 10.3.12.2.8 Five Biquads, First-Order IIR, AGC, Filter C
          9. 10.3.12.2.9 25-Tap FIR, First-Order IIR, AGC, Filter C
        3. 10.3.12.3 User-Programmable Filters
          1. 10.3.12.3.1 First-Order IIR Section
          2. 10.3.12.3.2 Biquad Section
          3. 10.3.12.3.3 FIR Section
        4. 10.3.12.4 Decimation Filter
          1. 10.3.12.4.1 Decimation Filter A
          2. 10.3.12.4.2 Decimation Filter B
          3. 10.3.12.4.3 Decimation Filter C
    4. 10.4 Device Functional Modes
      1. 10.4.1 Recording Mode
    5. 10.5 Programming
      1. 10.5.1 Digital Interfaces
        1. 10.5.1.1 I2C Control Mode
    6. 10.6 Register Maps
      1. 10.6.1 Control Registers
      2. 10.6.2 Control Registers, Page 0: Clock Multipliers and Dividers, Serial Interfaces, Flags, Interrupts and Programming of GPIOs
      3. 10.6.3 CONTROL REGISTERS Page 1: ADC Routing, PGA, Power-Controls, Etc.
      4. 10.6.4 Control Registers, Page 4: ADC Digital Filter Coefficients
      5. 10.6.5 Control Registers, Page 5: ADC Programmable Coefficients RAM (65:127)
      6. 10.6.6 Control Registers, Page 32: ADC DSP Engine Instruction RAM (0:31)
        1. 10.6.6.1 Page 32 / Register 5 Through Page 32 / Register 97
      7. 10.6.7 Control Registers, Page 33 Through Page 47: ADC DSP Engine Instruction RAM (32:63) Through (480:511)
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 ADC Setup
          1. 11.2.2.1.1 Step 1
          2. 11.2.2.1.2 Step 2
          3. 11.2.2.1.3 Example Register Setup to Record Analog Data Through ADC to Digital Out
        2. 11.2.2.2 MICBIAS
        3. 11.2.2.3 Decoupling Capacitors
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Community Resources
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
    4. 14.4 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Device and Documentation Support

14.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    E2E Audio Amplifier Forum TI's Engineer-to-Engineer (E2E) Community for Audio Amplifiers. Created to foster collaboration among engineers. Ask questions and receive answers in real-time.

14.2 Trademarks

NanoFree, PurePath, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

14.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

14.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.