SBASA91A December   2020  – June 2021 TLV320ADC3120

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 7.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 7.10 Timing Requirements: PDM Digital Microphone Interface
    11. 7.11 Switching Characteristics: PDM Digital Microphone Interface
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3  Input Channel Configurations
      4. 8.3.4  Reference Voltage
      5. 8.3.5  Programmable Microphone Bias
      6. 8.3.6  Signal-Chain Processing
        1. 8.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.6.2 Programmable Channel Gain Calibration
        3. 8.3.6.3 Programmable Channel Phase Calibration
        4. 8.3.6.4 Programmable Digital High-Pass Filter
        5. 8.3.6.5 Programmable Digital Biquad Filters
        6. 8.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.6.7 Configurable Digital Decimation Filters
          1. 8.3.6.7.1 Linear Phase Filters
            1. 8.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 8.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 8.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 8.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 8.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 8.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 8.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 8.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 8.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 8.3.6.7.2 Low-Latency Filters
            1. 8.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 8.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 8.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 8.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 8.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 8.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 8.3.6.7.3 Ultra-Low Latency Filters
            1. 8.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 8.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 8.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 8.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 8.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 8.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 8.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 8.3.7  Automatic Gain Controller (AGC)
      8. 8.3.8  Voice Activity Detection (VAD)
      9. 8.3.9  Digital PDM Microphone Record Channel
      10. 8.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode or Software Shutdown
      2. 8.4.2 Active Mode
      3. 8.4.3 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 TLV320ADC3120 Access Codes
      2. 8.6.2 Page 0 Registers
      3. 8.6.3 Page 1 Registers
      4. 8.6.4 Programmable Coefficient Registers
        1. 8.6.4.1 Programmable Coefficient Registers: Page 2
        2. 8.6.4.2 Programmable Coefficient Registers: Page 3
        3. 8.6.4.3 Programmable Coefficient Registers: Page 4
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Two-Channel Analog Microphone Recording
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Four-Channel Digital PDM Microphone Recording
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Example Device Register Configuration Script for EVM Setup
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Power Supply Recommendations

The power-supply sequence between the IOVDD and AVDD rails can be applied in any order. However, after all supplies are stable, then only initiate the I2C transactions to initialize the device.

For the supply power-up requirement, t1 and t2 must be at least 2 ms to allow the device to initialize the internal registers. See the Section 8.4 section for details on how the device operates in various modes after the device power supplies are settled to the recommended operating voltage levels. For the supply power-down requirement, t3 and t4 must be at least 10 ms. This timing (as shown in Figure 10-1) allows the device to ramp down the volume on the record data, power down the analog and digital blocks, and put the device into shutdown mode. The device can also be immediately put into shutdown mode by ramping down power supplies, but doing so causes an abrupt shutdown.

GUID-7D4C4E15-6622-4439-BE3D-BDD67965DC90-low.gif Figure 10-1 Power-Supply Sequencing Requirement Timing Diagram

Make sure that the supply ramp rate is slower than 1 V/µs and that the wait time between a power-down and a power-up event is at least 100 ms. For supply ramp rate slower than 0.1 V/ms, host device must apply a software reset as first transaction before doing any device configuration. Make sure all digital input pins are at valid input levels and not toggling during supply sequencing.

The TLV320ADC3120 supports a single AVDD supply operation by integrating an on-chip digital regulator, DREG, and an analog regulator, AREG. However, if the AVDD voltage is less than 1.98 V in the system, then short the AREG and AVDD pins onboard and do not enable the internal AREG by keeping the AREG_SELECT bit to 1b'0 (default value) of P0_R2. If the AVDD supply used in the system is higher than 2.7 V, then the host device can set AREG_SELECT to 1'b1 while exiting sleep mode to allow the device internal regulator to generate the AREG supply.