SBASA58A
December 2020 – June 2021
TLV320ADC5120
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: I2C Interface
7.7
Switching Characteristics: I2C Interface
7.8
Timing Requirements: TDM, I2S or LJ Interface
7.9
Switching Characteristics: TDM, I2S or LJ Interface
7.10
Timing Requirements: PDM Digital Microphone Interface
7.11
Switching Characteristics: PDM Digital Microphone Interface
7.12
Timing Diagrams
7.13
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Serial Interfaces
8.3.1.1
Control Serial Interfaces
8.3.1.2
Audio Serial Interfaces
8.3.1.2.1
Time Division Multiplexed Audio (TDM) Interface
8.3.1.2.2
Inter IC Sound (I2S) Interface
8.3.1.2.3
Left-Justified (LJ) Interface
8.3.1.3
Using Multiple Devices With Shared Buses
8.3.2
Phase-Locked Loop (PLL) and Clock Generation
8.3.3
Input Channel Configurations
8.3.4
Reference Voltage
8.3.5
Programmable Microphone Bias
8.3.6
Signal-Chain Processing
8.3.6.1
Programmable Channel Gain and Digital Volume Control
8.3.6.2
Programmable Channel Gain Calibration
8.3.6.3
Programmable Channel Phase Calibration
8.3.6.4
Programmable Digital High-Pass Filter
8.3.6.5
Programmable Digital Biquad Filters
8.3.6.6
Programmable Channel Summer and Digital Mixer
8.3.6.7
Configurable Digital Decimation Filters
8.3.6.7.1
Linear Phase Filters
8.3.6.7.1.1
Sampling Rate: 7.35 kHz to 8 kHz
8.3.6.7.1.2
Sampling Rate: 14.7 kHz to 16 kHz
8.3.6.7.1.3
Sampling Rate: 22.05 kHz to 24 kHz
8.3.6.7.1.4
Sampling Rate: 29.4 kHz to 32 kHz
8.3.6.7.1.5
Sampling Rate: 44.1 kHz to 48 kHz
8.3.6.7.1.6
Sampling Rate: 88.2 kHz to 96 kHz
8.3.6.7.1.7
Sampling Rate: 176.4 kHz to 192 kHz
8.3.6.7.1.8
Sampling Rate: 352.8 kHz to 384 kHz
8.3.6.7.1.9
Sampling Rate: 705.6 kHz to 768 kHz
8.3.6.7.2
Low-Latency Filters
8.3.6.7.2.1
Sampling Rate: 14.7 kHz to 16 kHz
8.3.6.7.2.2
Sampling Rate: 22.05 kHz to 24 kHz
8.3.6.7.2.3
Sampling Rate: 29.4 kHz to 32 kHz
8.3.6.7.2.4
Sampling Rate: 44.1 kHz to 48 kHz
8.3.6.7.2.5
Sampling Rate: 88.2 kHz to 96 kHz
8.3.6.7.2.6
Sampling Rate: 176.4 kHz to 192 kHz
8.3.6.7.3
Ultra-Low Latency Filters
8.3.6.7.3.1
Sampling Rate: 14.7 kHz to 16 kHz
8.3.6.7.3.2
Sampling Rate: 22.05 kHz to 24 kHz
8.3.6.7.3.3
Sampling Rate: 29.4 kHz to 32 kHz
8.3.6.7.3.4
Sampling Rate: 44.1 kHz to 48 kHz
8.3.6.7.3.5
Sampling Rate: 88.2 kHz to 96 kHz
8.3.6.7.3.6
Sampling Rate: 176.4 kHz to 192 kHz
8.3.6.7.3.7
Sampling Rate: 352.8 kHz to 384 kHz
8.3.7
Dynamic Range Enhancer (DRE)
8.3.8
Dynamic Range Compressor (DRC)
8.3.9
Automatic Gain Controller (AGC)
8.3.10
Voice Activity Detection (VAD)
8.3.11
Digital PDM Microphone Record Channel
8.3.12
Interrupts, Status, and Digital I/O Pin Multiplexing
8.4
Device Functional Modes
8.4.1
Sleep Mode or Software Shutdown
8.4.2
Active Mode
8.4.3
Software Reset
8.5
Programming
8.5.1
Control Serial Interfaces
8.5.1.1
I2C Control Interface
8.5.1.1.1
General I2C Operation
8.5.1.1.2
I2C Single-Byte and Multiple-Byte Transfers
8.5.1.1.2.1
I2C Single-Byte Write
8.5.1.1.2.2
I2C Multiple-Byte Write
8.5.1.1.2.3
I2C Single-Byte Read
8.5.1.1.2.4
I2C Multiple-Byte Read
8.6
Register Maps
8.6.1
Device Configuration Registers
8.6.1.1
TLV320ADC5120 Access Codes
8.6.2
Page 0 Registers
8.6.3
Page 1 Registers
8.6.4
Programmable Coefficient Registers
8.6.4.1
Programmable Coefficient Registers: Page 2
8.6.4.2
Programmable Coefficient Registers: Page 3
8.6.4.3
Programmable Coefficient Registers: Page 4
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Two-Channel Analog Microphone Recording
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Example Device Register Configuration Script for EVM Setup
9.2.1.3
Application Curves
9.2.2
Four-Channel Digital PDM Microphone Recording
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.2.1
Example Device Register Configuration Script for EVM Setup
9.3
What to Do and What Not to Do
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RTE|20
MPQF596
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbasa58a_oa
sbasa58a_pm
12.6
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.