SBASA92A December   2020  – June 2021 TLV320ADC6120

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 7.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 7.10 Timing Requirements: PDM Digital Microphone Interface
    11. 7.11 Switching Characteristics: PDM Digital Microphone Interface
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3  Input Channel Configurations
      4. 8.3.4  Reference Voltage
      5. 8.3.5  Programmable Microphone Bias
      6. 8.3.6  Signal-Chain Processing
        1. 8.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.6.2 Programmable Channel Gain Calibration
        3. 8.3.6.3 Programmable Channel Phase Calibration
        4. 8.3.6.4 Programmable Digital High-Pass Filter
        5. 8.3.6.5 Programmable Digital Biquad Filters
        6. 8.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.6.7 Configurable Digital Decimation Filters
          1. 8.3.6.7.1 Linear Phase Filters
            1. 8.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 8.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 8.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 8.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 8.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 8.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 8.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 8.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 8.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 8.3.6.7.2 Low-Latency Filters
            1. 8.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 8.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 8.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 8.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 8.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 8.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 8.3.6.7.3 Ultra-Low Latency Filters
            1. 8.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 8.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 8.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 8.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 8.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 8.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 8.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 8.3.7  Dynamic Range Enhancer (DRE)
      8. 8.3.8  Dynamic Range Compressor (DRC)
      9. 8.3.9  Automatic Gain Controller (AGC)
      10. 8.3.10 Voice Activity Detection (VAD)
      11. 8.3.11 Digital PDM Microphone Record Channel
      12. 8.3.12 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode or Software Shutdown
      2. 8.4.2 Active Mode
      3. 8.4.3 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 TLV320ADC6120 Access Codes
      2. 8.6.2 Page 0 Registers
      3. 8.6.3 Page 1 Registers
      4. 8.6.4 Programmable Coefficient Registers
        1. 8.6.4.1 Programmable Coefficient Registers: Page 2
        2. 8.6.4.2 Programmable Coefficient Registers: Page 3
        3. 8.6.4.3 Programmable Coefficient Registers: Page 4
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Two-Channel Analog Microphone Recording
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Four-Channel Digital PDM Microphone Recording
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Example Device Register Configuration Script for EVM Setup
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.3.1.2.2 Inter IC Sound (I2S) Interface

The standard I2S protocol is defined for only two channels: left and right. The device extends the same protocol timing for multichannel operation. In I2S mode, the MSB of the left slot 0 is transmitted on the falling edge of BCLK in the second cycle after the falling edge of FSYNC. Immediately after the left slot 0 data transmission, the remaining left slot data are transmitted in order. The MSB of the right slot 0 is transmitted on the falling edge of BCLK in the second cycle after the rising edge of FSYNC. Immediately after the right slot 0 data transmission, the remaining right slot data are transmitted in order. FSYNC and each data bit is transmitted on the falling edge of BCLK. Figure 8-5 to Figure 8-8 illustrate the protocol timing for I2S operation with various configurations.

GUID-B45A6BD2-2B55-424D-8BF5-430F35C0CBD7-low.gif Figure 8-5 I2S Mode Standard Protocol Timing (TX_OFFSET = 0)
GUID-5C8C4E0B-7788-405A-927F-93A2BBEC4396-low.gif Figure 8-6 I2S Protocol Timing (TX_OFFSET = 1)
GUID-555F5E33-1567-4FC0-89C2-B0CCCC8782E1-low.gif Figure 8-7 I2S Protocol Timing (No Idle BCLK Cycles, TX_OFFSET = 0)
GUID-78B1632E-931C-4081-A0CC-E8CE43F66D0A-low.gif Figure 8-8 I2S Protocol Timing (TX_OFFSET = 0 and BCLK_POL = 1)

For proper operation of the audio bus in I2S mode, the number of bit clocks per frame must be greater than or equal to the number of active output channels (including left and right slots) times the programmed word length of the output channel data. The device FSYNC low pulse must be a number of BCLK cycles wide that is greater than or equal to the number of active left slots times the data word length configured. Similarly, the FSYNC high pulse must be a number of BCLK cycles wide that is greater than or equal to the number of active right slots times the data word length configured.